Application of heat pipes to electronic equipment cooling

Feldmanis, C. J.

doi:10.2514/6.1972-269

Cited by 2 publications

(1 citation statement)

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“…Heat transfer analysis is also done in telecommunication application for temperature control [8][9]. The application of heat pipes to the electronic equipment which simplifies the entire thermal control unit by reducing weight and pumping equipments [10]. Some investigations are carried for achieving compact, high performance forced liquid cooling of planar integrated circuits and it was found that the convective heat transfer h between the substrate and coolant is the primary impediment for achieving low thermal resistance [11].…”

Section: Introductionmentioning

confidence: 99%

Thermal Management of an Electronic Board using CFD

Koushik¹

2019

IJRASET

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The rising demand for high performance and multiple functionality in electronic systems and devices continue to be the current great challenges in their thermal management. Thus, the effective removal of heat dissipations and maintaining a safe operating temperature has played an important role in insuring a reliable operation of electronic components. In this paper, a computational domain with thermal components like basechip and transistor placed in its location was considered. A fan was placed near ventilation such that the ambient air was forcely dragged into the enclosure carries the heat from the thermal components. CFD analysis has been conducted to examine the effect of variation in the cooling rate/ heat dissipation inside the components when the fan rotates at 1000 rpm. Investigations were conducted to understand the fluid flow behavior and heat transfer characteristics inside the cabinets. Results were measured at pseudo-steady state i.e., at the end of 1.8 sec, when the heat flux of 2500 w/m 2 input given to the thermal components. The area-weighted average static temperature was found to be around 800 K and 697 K respectively

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