Proceedings of the 7th International Conference on Fracture (ICF7) 1989
DOI: 10.1016/b978-0-08-034341-9.50110-8
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Application of Fracture Mechanics to Microscale Phenomena in Electronic Assemblies

Alan Burkhard
1
,
James M. Kallis
2
,
L.B. Duncan
3
et al.
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Cited by 2 publications
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