Application of advanced macro defect inspection technology for MEMS processes

Risk and reliability assessment about a manufacturing issue in a power MOSFET for automotive applications

“…The automatic inspection implemented by systems such as NSX tool, is based on training of the gray level for each pixel on about twenty training dice: a mean and standard deviation image, and upper and lower limits are created for the pixels [4]. The escape of the pin hole appeared when the contrast between the background metal and the pin hole was not sufficient (see Fig.…”