Application of adhesives in MEMS and MOEMS assembly: a review

Sarvar, F.; Hutt, David A.; Whalley, D.C.

doi:10.1109/polytr.2002.1020178

Cited by 30 publications

(15 citation statements)

References 8 publications

(4 reference statements)

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“…The cavity is formed by sealing a gap between a cap and a substrate wafer. More recently, polymers have gained widespread acceptance due to many advantages that they offer [49,50]. Examples of polymeric seals include benzocyclobutene (BCB), parylene, polyimide, and negative photo-resists [51,52].…”

Section: Moisture Transport Into/out Of a Cavity: Effective-volume Scmentioning

confidence: 99%

Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages

Jang

Han

2010

Moisture Sensitivity of Plastic Packages of IC Devices

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Semiconductor and MEMS packages have a unique engineering structure, in which various polymeric and inorganic materials are densely packed in millimeter-to micrometer-scale configurations. While inorganic materials (silicon, copper, aluminum, etc.) are impervious to moisture, polymers (molding compound, die attach, underfill, solder resist, etc.) absorb moisture and expand because of the absorbed moisture. This mismatch in hygroscopic swelling between the two material groups incurs deformations of semiconductor packages. The consequences of these deformations, as far as the induced stresses are concerned, are similar to the effect of the deformations induced by the mismatch in the thermal expansion.The analysis of moisture-induced deformations is essential to the assessment of the mechanical/functional integrity and performance of semiconductor and MEMS devices subjected to temperature and humidity excursions during their storage, manufacturing, and service life. It involves a moisture diffusion analysis and a subsequent stress analysis, where the combined effect of moisture and temperature distribution on the deformation is calculated [1]. Although moisture diffusion in polymers had been a classical research topic due to the impact of moisture itself on the state of polymers [2], the need to model moisture-related phenomena in complex structures arose quite recently, i.e., just a decade ago, as moisture-related issues such as pop-corning became important in semiconductor packages [3].This chapter describes recent progress in modeling of moisture diffusion and moisture-induced stresses in semiconductor and MEMS packages. It addresses both basic and practical aspects including (1) the theoretical background of moisture diffusion and hygroscopic swelling, (2) modeling schemes to solve moisture diffusion and combined hygro-thermo-mechanical stresses, and (3) validation of modeling schemes. Much of the chapter is excerpted from [1, 4] and [5] with the kind per-

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Section: Moisture Transport Into/out Of a Cavity: Effective-volume Scmentioning

confidence: 99%

Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages

Jang

Han

2010

Moisture Sensitivity of Plastic Packages of IC Devices

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“…Adhesive bonding has been the customary technique for fixing the fiber to the substrate in packaging applications [4], [5]. However, the requirement of a cure makes the process time-consuming, the outgassing after cure may make the use of these junctions unsuitable in certain systems, the limited tolerance to temperature changes can restrict the use of such assemblies, most dispensing methods lack accuracy at small target volumes and it is also difficult to precisely apply the adhesive as required for mass-production microassembly because it immediately starts spreading when it contacts the surface.…”

Section: Introductionmentioning

confidence: 99%

Experimental Evaluation of the Polarization Crosstalk When Soldering a Polarization-Maintaining Fiber Into a V-Grooved Substrate

Ojeda

Beckert

Burkhardt

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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The influence of stress on the polarization extinction ratio (PER) when solderjet-bumping a bow-tie polarizationmaintaining fiber (PMF) to a V-grooved ceramic substrate is experimentally evaluated. Throughout this paper, the linear polarization of the coupling laser beam is kept perpendicular to the V-grooved substrate plane while the fiber is rotated by a high-precision fiber gripper such that one of the fiber's main axes is aligned with the incoming polarization. On-axis alignment is conducted by positioning a small aspheric coupling lens with a high-precision multiaxis actuator. After alignment, the fiber is soldered to the substrate by a lead-free solder alloy. For each fiber sample, the PER is evaluated before and after soldering. Statistically relevant sample sets are evaluated in similar conditions and both fiber axes are considered for coupling. For the sake of comparison, this paper is also carried out while using UV-curing adhesive bonding as a fixing method. Under the experimental conditions, the decrease in PER when using solderjet bumping is evaluated to be about 7% of the initial value, showing that the technique could be suitable for massproduction PMF-based-devices microassembly. IndexTerms-Polarization extinction ratio (PER), polarization-maintaining fiber (PMF), solderjet bumping, UV-curing adhesive bonding, V-groove.

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“…Significant technological interest is currently focused on joining permanently two or more substrates for encapsulating the micromachined structures for various types of applications in the field of microelectronics, MEMS as well as sensors [1][2][3][4][5]. In an optically interrogated MEMS (MOEMS) sensor for example, optical pressure sensor, light from an optical fiber is used to interferometrically detect diaphragm deflection due to external pressure is formed by bonding a structured diaphragm on a ferrule containing optical fiber.…”

Section: Introductionmentioning

confidence: 99%