Application and mechanism analysis of functionalized ionic liquids in copper regeneration from electroplating sludge

Fabrication of highly conductive, flexible, and hydrophobic Kevlar®@Ni–P–B@Cu@CS fabric with excellent self-cleaning performance for electromagnetic interference shielding

“…Moreover, Cu electrodeposition is the main component of electroplating due to its excellent conductivity/cost ratio compared with gold and silver. [52][53][54] Cu has a high electrode potential and good corrosion resistance in normal application scenarios. However, Cu can be corroded and can develop rust on its surface when exposed to environments containing corrosive ions (such as Cl − and NH 4 + ).…”