Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes

Park, Seungsoo; Kim, Seong–Min; Han, Yosep; Park, Jaikoo

doi:10.1016/j.minpro.2015.09.013

Cited by 56 publications

(29 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…were detached from the boards using an apparatus specifically designed to disassemble electronic components and bare PCBs. 39) The bare PCBs were ground into particles smaller than 4 mm using a cut crusher (TOP-10-CC, Topcrusher, Korea) and then further ground to particles smaller than 1 mm with a grinder that uses shearing force as the main grinding mechanism (KNSP-5 SYS, KOEN, Korea). Using vibrating screens, the particles were classified to the following size ranges: 177250 µm, 250354 µm, 354500 µm, and 500 707 µm.…”

Section: Methodsmentioning

confidence: 99%

Liberation Characteristics Assessment for Copper Component in PCB Comminution Product by Image Analysis

et al. 2018

Self Cite

View full text Add to dashboard Cite

Cu is one of the most valuable metals found in waste printed circuit boards (PCBs). In order to recover the metals from the e-waste, PCB recycling process exploiting physical concentration techniques have widely been applied. Size reduction steps including crushing and grinding are done for liberation of Cu from the non-metallic materials such as glass fiber and epoxy resin. Degree of liberation is an important factor by which liberation performance of comminution process is evaluated. The primary purpose of this study was to investigate liberation characteristics of Cu particles in comminuted PCB by using image analysis method. The analysis procedures include image processing such as noise reduction, edge detection and component discrimination so that a set of images of ground PCB particles provides quantitative information such as Cu grade distribution and degree of Cu liberation. The Cu liberation phenomenon was also discussed in terms of its disassociation behavior from non-metallic material and grindability difference.

show abstract

Section: Methodsmentioning

confidence: 99%

Liberation Characteristics Assessment for Copper Component in PCB Comminution Product by Image Analysis

et al. 2018

Self Cite

View full text Add to dashboard Cite

show abstract

“…It is always difficult and costly to process, separate and recover values downstream from such heterogeneous and complex mixtures. Dismantling/disassembly is often carried out manually, making this step labour intensive, while automated systems are also developed for specific applications (Elo & Sundin, 2014;Park, Kim, Han, & Park, 2015;Kopacek, 2016).…”

Section: Manually Disassembly/dismantlingmentioning

confidence: 99%

Recent advances on hydrometallurgical recovery of critical and precious elements from end of life electronic wastes - a review

Sethurajan

Hullebusch

Fontana

et al. 2019

Critical Reviews in Environmental Science and Technology

244

101

View full text Add to dashboard Cite

Waste electrical and electronic equipment (WEEE) contains economically significant levels of precious, critical metals and rare earth elements, apart from base metals and other toxic compounds. Recycling and recovery of critical elements from WEEEs using a cost-effective technology are now one of the top priorities in metallurgy due to the rapid depletion of their natural resources. More than 150 publications on WEEE management, leaching and recovery of metals from WEEE were reviewed in this work, with special emphasize on the recent research (2015-2018). This paper summarizes the recent progress regarding various hydrometallurgical processes for the leaching of critical elements from WEEEs. Various methodologies and techniques for critical elements selective recovery (using ionic liquids, solvent extraction, electrowinning, adsorption, and precipitation) from the WEEEs leachates are discussed. Future prospects regarding the use of WEEEs as secondary resources for critical raw materials and its technoeconomical and commercial beneficiaries are discussed.

show abstract

“…Studies of disassembly technologies for the removal of ECs from the base board have focused on using mechanical methods to replace manual disassembly (Zeng et al, 2013;Yang et al, 2009;Lee et al, 2012). (Park et al (2015)) invented a disassembly apparatus for WPCB-ECs, in which the WPCBs was first heated with an infra-red heater in the disassembly module, then ECs were swept off from the base board by rotating steel brush rods. (Chen et al (2013)) proposed a technology of using hot air to melt electronic components from the base boards.…”

Section: Introductionmentioning

confidence: 99%

Thermal degradation and pollutant emission from waste printed circuit boards mounted with electronic components

Guo

Luo

Tan

et al. 2020

Journal of Hazardous Materials

View full text Add to dashboard Cite

Waste printed circuit boards mounted with electronic components (WPCB-ECs) are generated from electronic waste dismantling and recycling process. Airborne pollutants, including particulate matter (PM) and volatile organic compounds (VOCs), can be released during thermal treatment of WPCB-CEs. In this study, organic substances from WPCB-ECs were pyrolyzed by both thermo-gravimetric analysis (TGA) and in a quartz tube furnace. We discovered that board resin and solder coating were degraded in a one-stage process, whereas capacitor scarfskin and wire jacket had two degradation stages. Debromination of brominated flame retardants occurred, and HBr and phenol were the main products during TGA processing of board resin. Dehydrochlorination occurred, and HCl, benzene and toluene were detected during the pyrolysis of capacitor scarfskin. Benzene formation was found only in the first degradation stage (272-372°C), while toluene was formed both in the two degradation stages. PM with bimodal mass size distributions at diameters of 0.45-0.5 and 4-5 μm were emitted during heating WPCB-ECs. The PM number concentrations were highest in the size ranges

show abstract

Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes

Cited by 56 publications

References 18 publications

Liberation Characteristics Assessment for Copper Component in PCB Comminution Product by Image Analysis

Liberation Characteristics Assessment for Copper Component in PCB Comminution Product by Image Analysis

Recent advances on hydrometallurgical recovery of critical and precious elements from end of life electronic wastes - a review

Thermal degradation and pollutant emission from waste printed circuit boards mounted with electronic components

Contact Info

Product

Resources

About