ANSYS-based detailed thermo-mechanical modeling of complex thermoelectric power designs

Soto, M.; Venkatasubramanian, R.

doi:10.1109/ict.2005.1519923

Cited by 6 publications

(2 citation statements)

References 5 publications

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“…The temperature of the pellicles under EUV scanning was calculated using the conditions in Table 1, except for the exposure time (0.01 s) and incident heat flux (7.925 W cm −2 considering 65% reflection from the mask). 2,[24][25][26] The thermal analysis assumed uniform heat flux in a 10 mm × 110 mm rectangular slit and radiation as the only mechanism for heat dissipation. Tensile residual stress and gravity were applied to the EUV pellicle before applying the temperature load during the structural analysis.…”

Section: Fem Simulation Of a Wrinkle In The Slit Area Of The Euv Pelliclementioning

confidence: 99%

Impact of thermal expansion coefficient on the local tilt angle of extreme ultraviolet pellicle

Kim

Ahn

2022

J. Micro/Nanopattern. Mats. Metro.

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Background: A local tilt angle of <300 mrad results in a critical dimension uniformity (CDU) impact below 0.1 nm when a pellicle is used for extreme ultraviolet (EUV) lithography. However, the thermomechanical property guidelines satisfying this specification have not yet been established. Aim:We present the thermomechanical property guidelines that yield a CDU impact below 0.1 nm.Approach: The peak temperature ranges of the EUV pellicle, as a function of the emissivity, were calculated through experimental, numerical, and finite element method analyses. The wrinkle profiles were evaluated as a function of the coefficient of thermal expansion (CTE) within these temperature ranges. The emissivity and CTE values satisfying the specifications were obtained using the CDU impact caused by the wrinkled EUV pellicle. Results:The wrinkle amplitude in the EUV pellicle exhibited 45% attenuation with a twofold decrease in the CTE. The maximum local tilt angles for the 17, 16, and 15 nm half-pitch patterns were 290.2, 286.1, and 272.3 mrad, respectively. CTE below 2 × 10 −5 K −1 and emissivity above 0.1 are suggested for the EUV pellicle. Conclusions:The CTE and emissivity guidelines satisfying the CDU impact specifications can be used for developing next-generation EUV pellicles.

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Section: Fem Simulation Of a Wrinkle In The Slit Area Of The Euv Pelliclementioning

confidence: 99%

Impact of thermal expansion coefficient on the local tilt angle of extreme ultraviolet pellicle

Kim

Ahn

2022

J. Micro/Nanopattern. Mats. Metro.

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“…A PBA thermo-mechanical simulation tool based on ANSYS ® (Soto et al, 2009) software was developed to calculate the PCB warpage under a reflow temperature profile. In this section, the numerical modeling of a PCB and components (BGA, quad-flat no-lead [QFN] and connector), the boundary and loading (gravity) conditions and some remarkable features of the numerical simulation tool developed are described.…”

Section: Pre-processingmentioning

confidence: 99%

Realistic warpage evaluation of printed board assembly during reflow process

Chung

Kwak

2015

Soldering &Amp; Surface Mount Technology

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -This paper aims to develop an estimation tool for warpage behavior of slim printed circuit board (PCB) array while soldering with electronic components by using finite element method. One of the essential requirements for handheld devices, such as smart phone, digital camera, and Note-PC, is the slim design to satisfy the customers' desires. Accordingly, the printed circuit board (PCB) should be also thinner for a slim appearance, which would result in decreasing the PCB's bending stiffness. This means that PCB deforms severely during the reflow (soldering) process where the peak temperature goes up to 250°C. Therefore, it is important to estimate PCB deformation at a high temperature for thermo-mechanical quality/reliability after reflow process. Design/methodology/approach -A numerical simulation technique was devised and customized to accurately estimate the behavior of a thin printed board assembly (PBA) during reflow by considering all components, including PCB, microelectronic packages and solder interconnects. Findings -By applying appropriate constraints and boundary conditions, it was found that PBA's warpage can be accurately predicted during the reflow process. The results were also validated by warpage measurement, which showed a fairly good agreement with one and another. Research limitations/implications -For research limitations, there are many assumptions regarding numerical modeling. That is, the viscoplastic material property of solder ball is ignored, the reflow profile is simplified and the accurate heat capacity is not considered. Furthermore, the residual stress within the PCB, generated at PCB manufacturing process, is not included in this paper. Practical implications -This paper shows how to calculate PBA warpage during the reflow process as accurately as possible. This methodology helps a PCB designer and surface-mount technology (SMT) process manager to predict a PBA warpage issue and modify PCB design before PCB real fabrication. Practically, this modeling and simulation process can be easily performed by using a graphical user interface (GUI) module, so that the engineer can handle an issue by inputting some numbers and clicking some button...

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Influence of leg sizing and spacing on power generation and thermal stresses of thermoelectric devices

2015

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ANSYS-based detailed thermo-mechanical modeling of complex thermoelectric power designs

Cited by 6 publications

References 5 publications

Impact of thermal expansion coefficient on the local tilt angle of extreme ultraviolet pellicle

Impact of thermal expansion coefficient on the local tilt angle of extreme ultraviolet pellicle

Realistic warpage evaluation of printed board assembly during reflow process

Influence of leg sizing and spacing on power generation and thermal stresses of thermoelectric devices

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