This paper studies the short-circuit safe operating area (SCSOA) of the conventional field-stop (FS) IGBT and the superjunction (SJ) FS IGBT, based on 1200 V-rated samples, with the help of numerical electrothermal simulations. The results show that the peak electric field influences the distribution of the temperature inside devices and plays a crucial role in determining their SCSOAs. When the doping concentration of the collector, NC, is low, the peak electric field exits near the collector. Both types of IGBTs have a long short-circuit time, TSC, which can exceed 15 μs. TSC decreases with the increase of NC because the peak electric field transfers to near the channel. The introduction of the SJ structure weakens the peak electric field and increases TSC. The difference is at least 4 μs and up to 6.87 μs, when NC ranges from 2.0 × 10 17 cm -3 to 1.1 × 10 18 cm -3 . Besides, TSC of the SJ IGBT can be increased by using highly-doped pillars. Index Terms-Superjunction (SJ), Field-stop (FS), Short-circuit safe operating area (SCSOA), Insulated gate bipolar transistor (IGBT).