Anomalous increase of leakage current in epoxy moulding compounds under wet conditions

Balestra, Luigi; Cirioni, Leonardo; Cavallini, A.; Reggiani, Susanna; Rossetti, M.; Gallo, M.; Guarnera, Simone; Depetro, Riccardo

doi:10.1016/j.sse.2023.108728

Cited by 4 publications

(3 citation statements)

References 8 publications

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“…Following the literature [5], [7], [9], conduction mechanisms in EMC are described by means of the drift-diffusion transport model with Schottky boundary conditions to allow charge injection from the electrodes into the material bulk. Moreover, the physical effect of the barrier lowering has been included to reproduce the field-driven charge injection, which is a fundamental ingredient to explain the transient phenomenon of the current increase in EMC interdigitated capacitor under wet conditions [5]. As far as the transport properties of the EMC material are concerned, the Poole-Frenkel mobility model has been used since it is the most suitable to describe the field dependence of the conductivity in EMC [5], [7].…”

Section: Experimental Setup and Tcad Modelingmentioning

confidence: 99%

“…Moreover, the physical effect of the barrier lowering has been included to reproduce the field-driven charge injection, which is a fundamental ingredient to explain the transient phenomenon of the current increase in EMC interdigitated capacitor under wet conditions [5]. As far as the transport properties of the EMC material are concerned, the Poole-Frenkel mobility model has been used since it is the most suitable to describe the field dependence of the conductivity in EMC [5], [7]. The oxide layer has been modeled as an ideal insulator accounting for a specific value of the dielectric constant.…”

Section: Experimental Setup and Tcad Modelingmentioning

confidence: 99%

“…Thus, it is fundamental to properly predict the space charge accumulation in the proximity of such regions. Moreover, it has been recently found that charge injection from the electrodes of test capacitors made with wet EMCs gives rise to a transient phenomenon increasing the current during prolonged exposure to HV stresses [5]. It is thus extremely important to measure wet EMCs in similar conditions also in test chips where the charge transport in EMCs directly influences devices underneath.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs

Balestra,

Gnani,

Rossetti

et al. 2024

IEEE Trans. Electron Devices

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The reliability of high-voltage (HV) integrated circuits (ICs) can be significantly affected by space charge accumulation at the interface between the passivation layer and the epoxy molding compound (EMC) which acts as encapsulation material. The incorporation of moisture, which significantly increases the EMC conductivity, can lead to a stronger distortion of the electric field with a consequent breakdown instability. Moreover, the distance of the integrated-circuit active regions from the peripheral bond pads and wire would require a thorough optimization. To investigate the role played by the EMC under such conditions, a dedicated test chip made by an array of charge sensors covering short distances from bon-pads has been manufactured. A novel technique has been used to estimate the amount of space charge in the EMC independent of the bias applied to the bond pads. The outcome of the experiments has been explained by performing 2-D TCAD simulations of the structure under investigation which accurately account for the charge transport mechanisms of the EMC.

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Section: Experimental Setup and Tcad Modelingmentioning

confidence: 99%

Section: Experimental Setup and Tcad Modelingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs

Balestra,

Gnani,

Rossetti

et al. 2024

IEEE Trans. Electron Devices

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Leakage current as a probe into the mechanics of carrier transport in insulating composite polymers

Mamun,

Mavinkurve,

van Soestbergen

et al. 2024

Journal of Applied Physics

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Amorphous composite polymers are widely used as insulators in microelectronics due to their high dielectric strength, mechanical robustness, and thermal stability. However, organic–inorganic composite systems suffer from undesirable performance and accelerated degradation due to leakage current (JTot). Unfortunately, the underlying mechanism of JTot and its components (e.g., ionic and electronic constituents) are inadequately understood, particularly in extreme use conditions (e.g., high humidity and temperature). In this study, we use numerical simulation and experimental JTot data (in amorphous epoxy polymer with silica fillers) to (i) unify the electrostatic model for JTot in composite polymers, (ii) illustrate that the early part of JTot (i.e., external current) is primarily due to the image charge associated with ion transport/ localization (Jion) near the metallic contacts, (iii) demonstrate that the accumulated counter-ions reduce the barrier for electronic charge injection (by band bending) and facilitate electronic injection from the metals (Jelec), and (iv) provide an algorithm for the in situ ion transport characterization of composite insulators by exploiting Jion. This work provides new insights regarding the leakage current mechanism and how it can be used as a probe into the complex transport mechanisms of the composite material.

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Understanding the role of encapsulation layers under wet conditions on the reliability of power devices

Reggiani,

Balestra,

Gnani

et al. 2024

2024 8th IEEE Electron Devices Technology &Amp;amp; Manufacturing Conference (EDTM)

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Anomalous increase of leakage current in epoxy moulding compounds under wet conditions

Cited by 4 publications

References 8 publications

Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs

Characterization and TCAD Modeling of the Lateral Space Charge Accumulation in Epoxy Molding Compound in Packaged HV-ICs

Leakage current as a probe into the mechanics of carrier transport in insulating composite polymers

Understanding the role of encapsulation layers under wet conditions on the reliability of power devices

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