Anomalous high strain rate compressive behavior of additively manufactured copper micropillars

Ramachandramoorthy, Rajaprakash; Kalácska, Szilvia; Poras, Gabriel; Schwiedrzik, Jakob; Edwards, Thomas Edward James; Maeder, Xavier; Merle, Thibaut; Ercolano, Giorgio; Koelmans, Wabe W.; Michler, Johann

doi:10.1016/j.apmt.2022.101415

Cited by 9 publications

(7 citation statements)

References 74 publications

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“…The compressive strengths reported here-in particular for pillars of small grain size-are higher than values reported for pure copper films of similar grain size [28] (Figure 4d). The measured values values (up to 1.32 GPa) were however confirmed in previous studies of Cu printed by EHR-RP [9,26] and are approximately in line with data from recent work on copper pillars deposited by concentration-confined electrochemical AM [37] or meniscus-confined electrodeposition. [38] In general, a comparison to literature data should be regarded with some caution because often different criteria are used to determine the exact yield point.…”

Section: Strengthening Mechanismssupporting

confidence: 91%

“…[29]). In addition, previous measurements of Cu pillars fabricated by EHD‐RP [ 9 ] (gray, pillar diameter 700 n) and other electrochemical AM methods (orange [ 37 ] pillar diameter 2 µm, and green, [ 38 ] pillar diameter 700 nm) are shown.…”

Section: Resultsmentioning

confidence: 96%

“…This increased base strength suggest an additional hardening mechanism. The colored data points are values for hardness (open symbols, divided by 3) or compression yield strengths (solid symbols) of pure Cu thin films and micropillars reported in literature [29][30][31][32][33][34][35][36][37] (data set adapted from ref. [29]).…”

Section: Mechanical Propertiesmentioning

confidence: 99%

See 2 more Smart Citations

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing

Menétrey

Koch

Sologubenko

et al. 2022

Small

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The control of materials’ microstructure is both a necessity and an opportunity for micro/nanometer‐scale additive manufacturing technologies. On the one hand, optimization of purity and defect density of printed metals is a prerequisite for their application in microfabrication. On the other hand, the additive approach to materials deposition with highest spatial resolution offers unique opportunities for the fabrication of materials with complex, 3D graded composition or microstructure. As a first step toward both—optimization of properties and site‐specific tuning of microstructure—an overview of the wide range of microstructure accessed in pure copper (up to >99.9 at.%) by electrohydrodynamic redox 3D printing is presented, and on‐the‐fly modulation of grain size in copper with smallest segments ≈400 nm in length is shown. Control of microstructure and materials properties by in situ adjustment of the printing voltage is demonstrated by variation of grain size by one order of magnitude and corresponding compression strength by a factor of two. Based on transmission electron microscopy and atom probe tomography, it is suggested that the small grain size is a direct consequence of intermittent solvent drying at the growth interface at low printing voltages, while larger grains are enabled by the permanent presence of solvent at higher potentials.

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Section: Strengthening Mechanismssupporting

confidence: 91%

Section: Resultsmentioning

confidence: 96%

See 1 more Smart Citation

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing

Menétrey

Koch

Sologubenko

et al. 2022

Small

View full text Add to dashboard Cite

show abstract

“…Here, we present electrochemical (EC) 3D printing with a system called CERES (Exaddon AG, Switzerland) [28][29][30][31]. EC 3D printing is performed inside a supporting electrolyte bath and the EC reaction is confined by locally ejecting a metal electrolyte from a 300-nm-diameter nozzle.…”

Section: Introductionmentioning

confidence: 99%

“…The design space includes 3D bodies of seamlessly merged voxels, 90-degree overhangs and aspect ratios of over 50, on both flat and non-flat substrates. 3) No postprocessing is necessary to obtain a void-free material with the desired microstructure [5,30]. 4) EC deposition steps are fully compatible with integrated-circuit packaging and printed circuit boards (PCB) production processes.…”

Section: Introductionmentioning

confidence: 99%

Direct 3d Microprinting of Highly Conductive Gold Structures Via Localized Electrodeposition

Schuerch¹,

Osenberg²,

Testa³

et al. 2022

SSRN Journal

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Antimicrobial Evaluation of Metal Microneedles Made by Local Electrodeposition-Based Additive Manufacturing on Metal-Coated Substrates

Sachan,

Schürch,

Koelmans

et al. 2023

JOM

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Electrochemical-based additive manufacturing of metals has many potential uses for the manufacturing of medical devices with small-scale features. In this study, we examined the in vitro antimicrobial properties of metal microneedles made by local electrodeposition-based additive manufacturing called CERES (Exaddon AG, Switzerland) on metal substrates. Three-by-three arrays of copper microneedles were created on copper-coated silicon substrates. To understand the effect of a galvanic couple between gold microneedles and a copper substrate on the antimicrobial activity of the microneedle device, threeby-three arrays of copper microneedles were created on gold-coated silicon substrates. Scanning electron microscopy was used to understand the microstructure of the microneedles; the microneedles were shown to possess hollow bores and sharp tips. X-ray photoelectron spectroscopy indicated the presence of copper, carbon, oxygen, silicon, and nitrogen as well as the absence of toxic impurities for the copper microneedles on copper-coated silicon substrates. X-ray photoelectron spectroscopy indicated the presence of copper, carbon, oxygen, copper, gold, and silicon as well as the absence of toxic impurities for the copper microneedles on gold-coated silicon substrates. In vitro cell colonization studies involving the Gram-positive bacterium Staphylococcus epidermidis, the Gram-negative bacterium Escherichia coli, and the opportunistic fungal pathogen Candida albicans at two hour and twenty four hour colonization at 37 o C showed generally stronger activity for copper microneedles on copper-coated silicon substrates than for copper microneedles on gold-coated silicon substrates and uncoated silicon substrates. The copper microneedles on gold-coated silicon substrates showed stronger antimicrobial activity than uncoated silicon substrates except for twenty four hour colonization with Escherichia coli. The results of this study show potential strategies for creating antimicrobial microneedles for medical applications via local electrodeposition-based additive manufacturing.

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Anomalous high strain rate compressive behavior of additively manufactured copper micropillars

Cited by 9 publications

References 74 publications

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing

Direct 3d Microprinting of Highly Conductive Gold Structures Via Localized Electrodeposition

Antimicrobial Evaluation of Metal Microneedles Made by Local Electrodeposition-Based Additive Manufacturing on Metal-Coated Substrates

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