Anomalous change of electrical resistivity with temperature in liquid Pb–Sn alloys

Li, Yuanxing; Zu, Fang‐Qiu; Ding, Hongyan; Yu, Jiahui; Liu, Lanjun; Li, Qiang; Xi, Yun

doi:10.1016/j.physb.2004.12.037

Cited by 56 publications

(28 citation statements)

References 20 publications

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“…The detailed method of the electrical resistivity was demonstrated in Refs. [37][38][39][40][41]. The resistivity experiment results display abundant physical images of liquid matter in response to temperature.…”

Section: Electrical Resistivity Behaviors Of Liquid Alloys Versus Temmentioning

confidence: 99%

Temperature-Induced Liquid-Liquid Transition in Metallic Melts: A Brief Review on the New Physical Phenomenon

2015

Metals

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Understanding the nature of liquid structures and properties remains an open problem for many fundamental and applied fields. It is well known that there is no other defined phase line above liquidus (TL) in phase diagrams of ordinary alloys. However, via resorts of internal friction, electric resistivity, thermal analysis, X-ray diffraction, solidification, etc., the results of our research on lots of single-and multiple-component melts show a novel physical image: temperature induced liquid-liquid structure transition (TI-LLST) can occur above TL. Moreover, the solidification behaviors and structures out of the melts that experienced TI-LLST are distinct from those out of the melts before TI-LLST. In this paper, some typical examples of TI-LLST and characteristic aspects of the TI-LLST are briefly reviewed, in which the main contents are limited in our own achievements, although other groups have also observed similar phenomena using different methods. In the sense of phenomenology, TI-LLST reported here is quite different from other recognized liquid transitions, i.e., there are only a few convincing cases of liquid P, Si, C, H2O, Al2O3-Y2O3, etc. in which the transition occurs, either induced by pressure or at a supercooled state and near liquidus.

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Section: Electrical Resistivity Behaviors Of Liquid Alloys Versus Temmentioning

confidence: 99%

Temperature-Induced Liquid-Liquid Transition in Metallic Melts: A Brief Review on the New Physical Phenomenon

2015

Metals

Self Cite

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“…1(b), Bi 6 Te 7 and/or BiTe will form in the same temperature range. So we chose the temperature 525 C for the isothermal experiments in which, to track the solidification process, electrical resistivity was recorded by means of the DC fourprobe technology, which had been described in [23]. The errors of temperature and resistivity were under 1 C and 0.05 mU cm.…”

Section: Isothermal Solidification Experiments Tracked With Electricamentioning

confidence: 99%

The dependence of phase selection in peritectic solidification of Bi–Te40 on cooling rates and liquid states

Huang

Chen

et al. 2010

Intermetallics

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“…The details of the measuring method are the same as what we have described earlier [14]. In order to confirm the accuracy of the results obtained by the resistivity method, the DSC thermal analysis has also been adopted to study the LLSC in heating process by NETZSCH DSC 404 (the SnBi 17 Cu 0.5 sample (50 mg) was held in Al 2 O 3 ceramic crucibles, heating rate was 20…”

Section: Methodsmentioning

confidence: 99%

Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy

Chen¹,

Bao²,

Huang³

et al. 2016

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The melt structure transition behaviors of SnBi17Cu0.5 solder alloy were investigated in detail. By Differential Scanning Calorimetry (DSC) and electrical resistivity method, an anomalous change has been found in 835-875• C during heating process on the ρ-T and DSC curves. It reveals that a liquid-liquid structure change (LLSC) occurs in the melt. Through melt overheating treatment, the influence of LLSC on solidification process and material properties has been further studied: bigger solidification undercooling degree in the solidification process, finer and more dispersing solidification structure, and more importantly, the mechanical and welding properties of the solder alloy have also been obviously improved.K e y w o r d s : melt structure, liquid structure change, SnBi17Cu0.5 solder, soldering property, solidification

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Anomalous change of electrical resistivity with temperature in liquid Pb–Sn alloys

Cited by 56 publications

References 20 publications

Temperature-Induced Liquid-Liquid Transition in Metallic Melts: A Brief Review on the New Physical Phenomenon

Temperature-Induced Liquid-Liquid Transition in Metallic Melts: A Brief Review on the New Physical Phenomenon

The dependence of phase selection in peritectic solidification of Bi–Te40 on cooling rates and liquid states

Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy

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