Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions

Jung, Junhee; Lee, Shin-Bok; Joo, Young‐Chang; Lee, Ho‐Young; Park, Young-Bae

doi:10.1016/j.mee.2008.03.015

Cited by 42 publications

(18 citation statements)

References 15 publications

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“…The formation of SnO 2 on the surface of Sn-based alloys had been reported in various solutions (Jung et al 2008;Nazeri and Mohamad 2014). Similar SnO 2 reaction products are observed in the present study.…”

Section: Discussionsupporting

confidence: 92%

Leaching behaviour and environmental risk assessment of heavy metals from electronic solder in acidified soil

Lao

Cheng

Min

et al. 2015

Environ Sci Pollut Res

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The leaching behaviour of Sn and Pb elements from eutectic SnPb solder of electronic waste in acidic soil was investigated through acidification with HCl-H2SO4 solution and compared with saline solution. The amounts of Sn and Pb elements leached, when subjected to acidic soil, are higher than those with saline soil. Evidence for the significantly preferential release of Sn into the leachate is provided; the galvanic couple accelerated such preferential release. Surface product analysis reveals the slight damage of SnPb in saline soil. Serious dissolution due to electrochemical reaction and a thick, porous PbSO4 surface layer are observed in acidified soil, suggesting more severe toxicity potential of Pb in soil rather than in water.

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Section: Discussionsupporting

confidence: 92%

Leaching behaviour and environmental risk assessment of heavy metals from electronic solder in acidified soil

Lao

Cheng

Min

et al. 2015

Environ Sci Pollut Res

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“…The time-to-failure of Sn-Pb solder alloys increased with increasing Pb content. 67 However, Jung et al 66 found that the time-to-failure of Sn in NaCl solution was longer than that in Na 2 SO 4 solution. Moreover, the pitting potential of Sn in NaCl solution was also higher than that in Na 2 SO 4 solution.…”

Section: -636667mentioning

confidence: 99%

“…A similar phenomenon was also found for Sn-3Ag-0.5Cu solder alloy in Na 2 SO 4 solution where the passive lm is thinner than that formed in NaCl solution. 66 …”

Section: -636667mentioning

confidence: 99%

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Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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“…Indeed, the ECM phenomenon of Sn is strongly affected by the Sn corrosion behavior [5][6][7][8]. However, the details of the correlation between Sn corrosion behavior and time-to-failure (TTF) during WDT, which is an acceleration test of the ECM, are not understood well.…”

Section: Introductionmentioning

confidence: 99%

Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

Lee

Jung

Lee

et al. 2009

2009 59th Electronic Components and Technology Conference

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As electronic packages become smaller in size, the pitch of metal line is getting shorter. Decrease of line pitch in electronic packages and substrate of electronic component causes the electrochemical migration (ECM) more frequently. If the electronic components are exposed to high temperature and high humidity environments with authorized voltage condition, the metals in packages and substrate are easily ionized and form conductive dendrites, leading to insulation failure. ECM process consists of three steps: anodic dissolution, ion migration, and dendritic growth. The first step is the most important because anodic dissolution determines strongly affect the occurrence of remaining steps. In this work, anodic dissolution of Sn solder is characterized by water-drop test (WDT) and anodic polarization teat (APT). Initial anodic dissolution current of Sn solder is measured in 0.001 wt.% NaCl, Na 2 SO 4 solutions and deionized water by WDT, and the results were compared with APT results. It is found that the higher the voltage is, the shorter the time-tofailure (TTF) is. In lower-voltage condition, anodic dissolution current is limited by passivity formation. The pitting corrosion occurred in higher voltage condition with shorter TTF. The anodic dissolution current is dependent on the electrolyte: the highest value in 0.001 wt.% NaCl solution and lowest value in D.I water. IntroductionElectronic components are moving towards miniaturization and high-density integration. Therefore the pitches between the metal lines of packaging in electronic systems are getting smaller. The metal lines used under high humidity, high temperature and high voltage-applied conditions are prone to be electrochemically unstable and ionized [1][2][3][4]. The formed metal ions move from anode to cathode by electric filed through non metallic medium and a conductive metal filament forms between the anode and the cathode. Filaments formed near the anode are called conductive anodic filaments (CAFs), and those formed on the cathode are called dendrites. They are closely related to the insulation failure which leads to malfunction and final failure of the electronic devices. This phenomenon is called electrochemical migration (ECM) or ion migration. ECM is known to be correlated with the corrosion characteristics of the anode in terms of anodic dissolution.ECM process is composed of three steps: anodic dissolution, ion migration, and dendritic growth. Actually, ECM is initiated by anodic dissolution of electrode metal and this is critical process of ECM failure. Acceleration condition of harsh environment can be made using water-dropped situation with voltage bias which is called water-drop test

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Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions

Cited by 42 publications

References 15 publications

Leaching behaviour and environmental risk assessment of heavy metals from electronic solder in acidified soil

Leaching behaviour and environmental risk assessment of heavy metals from electronic solder in acidified soil

Electrochemical migration of Sn and Sn solder alloys: a review

Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

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