Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method

Koebel, Matthias M.; Hawi, Nancy El; Lu, Jia Chun; Gattiker, F.; Neuenschwander, J.

doi:10.1016/j.solmat.2011.06.012

Cited by 25 publications

(8 citation statements)

References 24 publications

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“…Nevertheless, VG still offers great potential to revolutionize the glazing and building insulation markets, however new, advanced edgesealing and integrated manufacture concepts are necessary. At best, the realization and implementation of distinct technological advances [21] could reach the public markets within the next 10 years. Alternative highly insulating translucent glazing systems are aerogel-filled windows which are already available on the market.…”

Section: Evacuated Superinsulation Systemsmentioning

confidence: 99%

Aerogel-based thermal superinsulation: an overview

Koebel

Rigacci

Achard

2012

J Sol-Gel Sci Technol

578

321

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International audienceThis review is focused on describing the intimate link which exists between aerogels and thermal superinsulation. For long, this applied field has been considered as the most promising potential market for these nanomaterials. Today, there are several indicators suggesting that this old vision is likely to become reality in the near future. Based on recent developments in the field, we are confident that aerogels still offer the greatest potential for non-evacuated superinsulation systems and consequently must be considered as an amazing opportunity for sustainable development. The practical realization of such products however is time-consuming and a significant amount of R&D activities are still necessary to yield improved aerogel-based insulation products for mass markets

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Section: Evacuated Superinsulation Systemsmentioning

confidence: 99%

Aerogel-based thermal superinsulation: an overview

Koebel

Rigacci

Achard

2012

J Sol-Gel Sci Technol

578

321

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“…The new bond formation entails two processes, an electrochemical reaction and the diffusion of charged species (anions and cations) at the interfaces between the solder glass and the plane glass sheet . When the sample was applied with the voltage, the atoms of the solder glass at the interface between the low‐melting point glass coating and plane glass sheet experienced an electrochemical potential.…”

Section: Resultsmentioning

confidence: 99%

Enhanced vacuum glazing bonding strength by anodic bonding‐assisted sealing method

Chen

Zhang

et al. 2019

Int J of Appl Glass Sci

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A novel sealing method of vacuum glazing is introduced in this study. Anodic bonding technology was used to enhance the bonding strength of the sealant of vacuum glazing. Two sheets of plane glass were sealed by V2O5‐P2O5‐TeO2 glass powder with low glass transition temperature (339.3℃) using anodic bonding‐assisted low‐temperature sintering. Through analyzing the results of Shear Strength test, the diagram of microstructures of the sealing bond taken by a micro Super‐depth Microscopy, Scanning Electron Microscope (SEM), and Energy Dispersive Spectrometer (EDS), the best bonding treatment schedule was determined for achieving the strongest bond. The experiment results show that anodic bonding has a dramatic influence on bonding performance. When the sealing temperature and bonding time are kept constant, the shear strength of the sample increases by increasing the bonding voltage. With the bonding temperature of 470℃ and the voltage of 600 V, the air tightness of the sealed sample is 3.9 × 10−9 Pa·m3/s. The improved bonding strength can enhance life‐time of vacuum glazing.

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“…A more detailed description of the ALTSAB bonding process can be found in. 10 For each condition (alloy type, U and T combination), three identical samples were fabricated and characterized.…”

Section: Methodsmentioning

confidence: 99%

“…One such system with a potentially large impact on society is the edge seal of a vacuum glazing, where the sum of permeation and outgassing rates 6 must not exceed 10 −12 mbar • l • s −1 . Traditionally, glass-to-metal seals are created by a brazing process, which is at a temperature significantly higher than 400 • C. Recently, we have reported an alternative method termed Activated Liquid Tin Solder Anodic Bonding (ALTSAB) 10 combining the advantage of perfect sealant adaptation to the surface with moderate process temperatures (below 300 • C) and high-vacuum compatibility. In this previous work, the ability of ALTSAB to produce glass-metal seals with excellent hermeticity and high toughness was demonstrated.…”

mentioning

confidence: 99%

Glass-to-Glass Anodic Bonding with Liquid Tin Based Fillers: A Mechanistic Study

Hawi

Gerussi

Koebel

2013

ECS J. Solid State Sci. Technol.

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A new variant of solid state anodic bonding termed activated liquid tin solder anodic bonding (ALTSAB) was recently developed. Here, we report the systematic investigation of bonding parameters temperature, bonding voltage and the alloy composition in a sandwich type configuration with soda-lime glass. Of the five different alloys tested (Sn, SnAl0.6, SnMg0.6, SnLi0.02 and SnLi0.06), SnAl shows the best mechanical integrity of the glass-metal-glass bonds and the lowest current density values during bonding. SnLi alloys entail very high bonding current densities up to 4 mA cm −2 at 270 • C and 800 V but poor mechanical performance due to alkali corrosion of the glass at the bonding interface. Supported by the large drift currents in the case of Li containing alloys, it is believed that the overall ALTSAB process is anode limited. With SnAl0.6 alloys, bonds with a shear strength >35 MPa can be produced in less than 7 minutes at a mere 270 • C. From temperature dependent data, apparent activation energies in the 70-100 kJ mol −1 range were extracted for all alloys, as it is expected for ion transport processes in soda lime glass. Compared to conventional anodic bonding, ALTSAB offers improved mechanical strength at far lower process temperature and voltage.For a number of technical applications, the ability to create hermetic seals of high durability and low gas permeation are essential for the overall system performance. In some cases, such as the packaging of oxygen sensitive organic light emitting devices (OLED) display panels, 1,2 photovoltaic elements, 3 microelectronic devices 4,5 and vacuum glazing, 6 more stringent tightness requirement excludes the use of rubber or polymer based sealant materials. 7,8 Especially when targeting extremely low gas permeation rates (water, oxygen), the use of inorganic sealants is almost indispensable. Metallic seals in particular are known to provide the highest barrier function due to their extremely low diffusivity values. 9 Very few examples of large area seals are known, where extreme tightness is required. One such system with a potentially large impact on society is the edge seal of a vacuum glazing, where the sum of permeation and outgassing rates 6 must not exceed 10 −12 mbar · l · s −1 . Traditionally, glass-to-metal seals are created by a brazing process, which is at a temperature significantly higher than 400 • C. Recently, we have reported an alternative method termed Activated Liquid Tin Solder Anodic Bonding (ALTSAB) 10 combining the advantage of perfect sealant adaptation to the surface with moderate process temperatures (below 300 • C) and high-vacuum compatibility. In this previous work, the ability of ALTSAB to produce glass-metal seals with excellent hermeticity and high toughness was demonstrated. When compared to standard soldering the sealing is achieved within one single step, so neither pre-nor post-treatments are required. The omission of glass premetallization and the perfect self-adaptation of the liquid metal sealant make ALTSAB a very promising tec...

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Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method

Cited by 25 publications

References 24 publications

Aerogel-based thermal superinsulation: an overview

Aerogel-based thermal superinsulation: an overview

Enhanced vacuum glazing bonding strength by anodic bonding‐assisted sealing method

Glass-to-Glass Anodic Bonding with Liquid Tin Based Fillers: A Mechanistic Study

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