Anodic bonding

Knowles, Kevin M.; Helvoort, Antonius T. J. van

doi:10.1179/174328006x102501

Cited by 116 publications

(73 citation statements)

References 183 publications

(452 reference statements)

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“…The phenomenon is known as anodic adhesion and was recently reviewed by Knowles and van Helvoort. 17 The changes in the infrared spectra ͑Fig. 4͒ of the anodic surface are much more pronounced than that of the cathodic one, indicating that the glass structure near the anode has been highly modified.…”

Section: Discussionmentioning

confidence: 98%

Compositional and structural changes at the anodic surface of thermally poled soda-lime float glass

Ziemath¹,

Araújo²,

Escanhoela³

2008

Journal of Applied Physics

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Applying high dc electric fields at elevated temperatures on silicate glasses results in displacement of ions, causing compositional and structural changes in the anodic surface. In this work, the ionic displacement was accompanied by electric current measurements during poling. The thickness of the Na + depletion layer calculated from the current curves agrees with the thickness measured by EDS only if displacement of Ca 2+ and O − are also taken into account. A depletion of Ca 2+ in the anodic surface has in fact been observed. Structural changes were confirmed by infrared diffuse and specular reflectance spectroscopies. A narrowing of the band at about 1070 cm −1 can be attributed to an increase in the structural ordering degree. Refractive index measurements confirm compositional changes and contact angle measurements indicate the existence of a negative charge density at the anodic surface.

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Section: Discussionmentioning

confidence: 98%

Compositional and structural changes at the anodic surface of thermally poled soda-lime float glass

Ziemath¹,

Araújo²,

Escanhoela³

2008

Journal of Applied Physics

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“…We aim to seal glass to silicon and therefore must match CTEs to reduce stresses and therefore increase yield. Pyrex is the most common glass bonded to silicon due to their comparable CTEs and its sodium content required for anodic bonding 136 (see Section IV C). This borosilicate glass is so highly permeable to helium that we should expect to lose UHV several days after bonding (see Figure 4).…”

Section: B Permeationmentioning

confidence: 99%

“…Should anodic bonding be used to seal the chips, oxygen will be released along the inner bonding edges where the voltage is high and no silicon exists to bond with the non-bridging oxygen atoms 136,172,241 . Predicting the amount of oxygen released is unreliable due to the lack of data and the effects of bonding parameters, chip dimensions, and increased outgassing at raised temperatures.…”

Section: Other Gasesmentioning

confidence: 99%

“…Anodic bonding occurs between an oxide forming metal (or semiconductor) and an alkali containing glass, by heating the two materials together (300-500 • C) with the simultaneous application of a high voltage (100-1000 V) across the interface 136,138 . The mobility of the alakli ions (typically sodium or lithium) in the glass is increased with temperature and they are pulled away from the interface by the electric potential.…”

Section: Anodic Bondingmentioning

confidence: 99%

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Contributed Review: The feasibility of a fully miniaturized magneto-optical trap for portable ultracold quantum technology

Rushton

Aldous

Himsworth

2014

Review of Scientific Instruments

104

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Experiments using laser cooled atoms and ions show real promise for practical applications in quantumenhanced metrology, timing, navigation, and sensing as well as exotic roles in quantum computing, networking and simulation. The heart of many of these experiments has been translated to microfabricated platforms known as atom chips whose construction readily lend themselves to integration with larger systems and future mass production. To truly make the jump from laboratory demonstrations to practical, rugged devices, the complex surrounding infrastructure (including vacuum systems, optics, and lasers) also needs to be miniaturized and integrated. In this paper we explore the feasibility of applying this approach to the Magneto-Optical Trap; incorporating the vacuum system, atom source and optical geometry into a permanently sealed microlitre system capable of maintaining 10 −10 mbar for more than 1000 days of operation with passive pumping alone. We demonstrate such an engineering challenge is achievable using recent advances in semiconductor microfabrication techniques and materials.PACS numbers: 07.07.Df, 37.10.Gh, 07.30.Kf, I. ULTRACOLD QUANTUM TECHNOLOGYSince the first demonstrations of atoms and ions at sub-millikelvin temperatures in the mid-1980s, the field of atomic physics has been revolutionized by laser cooling and trapping as it provides researchers with a method to probe some of the purest and sensitive quantum systems available. This field is still highly productive and recently has put significant emphasis on the practical applications of this technology beyond the laboratory 1,2 . It was evident very early on that ultracold matter would be an indispensable tool in precise timing applications and a recent demonstration 3 has shown extremely low instabilities at the 10 −18 level. The wavelike nature of atoms as they are cooled to lower temperatures can be used to form atomic interferometers that outperform optical counterparts in measurements of accelerated reference frames 4-7 , which are important for inertial guidance systems, but can also provide sensitive measurements of mass, charge and magnetic fields [8][9][10][11] . Greater sensitivity beyond the classical limit is possible via squeezed 12 and entangled states 13-15 , which are also fundamental attributes for quantum computing 16,17 , and long distance quantum networking 18 . Ultracold matter has been used in the emerging field of quantum simulation 19 and is an indispensable tool in determining fundamental constants 20 , testing general relativity 21 and defining measurement standards 22 . Many researchers and industries believe such tools will be a major part of the 'second quantum revolution' in which the more 'exotic' properties of quantum physics are applied for practical applications 23,24 .The field of ultracold matter has reached a matua) m.d.himsworth@soton.ac.uk rity in both experimental methods and theoretical understanding allowing experiments to begin leaving the laboratory 25-27 . These systems are bespoke, rarely take up a ...

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“…2 The process is particularly useful for microelectromechanical system ͑MEMS͒ pressure sensors and other transducers and in weather sealing of solar cells because the bond hermetically seals the surfaces together. 3 In our research group we use the process for sealing -reactors for catalyst characterization; 4 however for this application the high temperatures needed for successful anodic bonding may cause catalysts to sinter or otherwise lose activity. An example of this is Au-based catalysts, which are notorious for deactivating since activity is dependant on very small Au particle size.…”

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confidence: 99%

Note: Anodic bonding with cooling of heat-sensitive areas

Vesborg

Olsen

Henriksen

et al. 2010

Review of Scientific Instruments

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Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling heat-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature.

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Anodic bonding

Cited by 116 publications

References 183 publications

Compositional and structural changes at the anodic surface of thermally poled soda-lime float glass

Compositional and structural changes at the anodic surface of thermally poled soda-lime float glass

Contributed Review: The feasibility of a fully miniaturized magneto-optical trap for portable ultracold quantum technology

Note: Anodic bonding with cooling of heat-sensitive areas

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