Annotated tin whisker bibliography and anthology

Galyon, G.T.

doi:10.1109/tepm.2005.847440

Cited by 193 publications

(127 citation statements)

References 49 publications

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“…The effect of electrochemical oxidation potential on the Sn oxide thickness, for a charge passed of 30 mC cm -2 , is shown in the XPS high resolution scans of the Sn 3d peak in figure [2]; a high resolution Sn 3d scan of a native air-formed oxide is also shown for comparison.…”

Section: Development Of the Electrochemical Oxidementioning

confidence: 99%

“…A tin whisker is a growth of pure tin that is commonly in the form of a filament, which can grow up to a few millimetres in length, from a thin tin coating (around 0.5-50 µm thick) that has been electroplated onto a substrate 2 . The incubation period prior to the growth of a whisker is uncertain and it is this unpredictability that causes concern to the reliable operation of electronic components 3 .…”

Section: Introductionmentioning

confidence: 99%

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Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment

Haspel

Ashworth

et al. 2015

Transactions of the IMF

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There are very few studies that have investigated directly the effect of an oxide film on tin whisker growth, since the 'cracked oxide theory' was proposed by Tu in 19941 . The current study has investigated the effect of an electrochemically produced oxide on tin whisker growth, for both Sn-Cu electrodeposits on Cu and pure Sn electrodeposits on brass. X-ray photoelectron spectroscopy (XPS) has been used to investigate the effect of the applied electrochemical oxidation potential on the oxide film thickness. Focused ion beam (FIB) has been used to prepare cross sections from electrodeposited samples to investigate the influence of the electrochemically formed oxide film on deposit microstructure during longterm room temperature storage. The XPS studies show that the thickness of electrochemically formed oxide film is directly influenced by the applied potential and the total charge passed. Whisker growth studies show that the electrochemical oxidation treatment mitigates whisker growth for both Sn-Cu electrodeposits on Cu and pure Sn electrodeposits on brass. For Sn electrodeposits on brass, the electrochemically formed oxide greatly reduces both the formation of zinc oxide at the surface and the formation of intermetallic compounds, which results in the mitigation of tin whisker growth. For Sn-Cu electrodeposits on Cu, the electrochemically formed oxide has no apparent effect on intermetallic compound formation and acts simply as a physical barrier to hinder tin whisker growth.

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Section: Development Of the Electrochemical Oxidementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment

Haspel

Ashworth

et al. 2015

Transactions of the IMF

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“…[1][2][3][4][5] Whisker growth results in many serious short-term and long-term reliability issues in the electronic assemblies used in critical applications, for example aviation and space, defense, medical devices, etc., in which whisker-induced electrical short circuits and mass redistribution in conductors have resulted in complete failure of commercial satellites, defense systems, and medical equipments. 6,7 Alloying with Pb has been reported to reduce the extent of whisker formation on Sn coatings [7][8][9][10] ; this effect has been attributed to substantial reduction of the maximum compressive stress generated in Sn coatings on addition of Pb.…”

Section: Introductionmentioning

confidence: 99%

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

Jagtap

Kumar

2015

Journal of Elec Materi

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The effects of two major electrodeposition process conditions, electrolyte bath temperature and current density, on the microstructure and crystallographic texture of pure tin coatings on brass and, ultimately, on the extent of whisker formation have been examined. The grain size of the deposited coatings increased with increasing electrolyte bath temperature and current density, which significantly affected the dominant texture: (211) or (420) was the dominant texture at low current densities whereas, depending on deposition temperature, (200) or (220) became the dominant texture at high current densities. After deposition, coatings were subjected to different environmental conditions, for example isothermal aging (room temperature, 50°C, or 150°C) for up to 90 days and thermal cycling between À25°C and 85°C for 100 cycles, and whisker growth was studied. The Sn coatings with low Miller index planes, for example (200) and (220), and with moderate aging temperature were more prone to whiskering than coating with high Miller index planes, for example (420), and high aging temperature. A processing route involving the optimum combination of current density and deposition temperature is proposed for suppressing whisker growth.

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“…Without Pb, the military, aerospace, and other high-reliability industries have experienced increased risks of system failure due to tin whiskers that cause electrical short circuits, impact highfrequency circuits, and create loose debris. 1,2 The majority of recent tin whisker research has concentrated on coupons or components with an emphasis on the Sn plating composition, thickness, grain size, grain orientations, and Ni underlayer. [2][3][4][5][6][7][8][9][10][11][12] These studies produced a great deal of knowledge; however, they do not consider the very real situation in which components are assembled on circuit boards using Pb-free solder pastes.…”

Section: Introductionmentioning

confidence: 99%

Whisker Formation on SAC305 Soldered Assemblies

Meschter

Snugovsky²,

Bagheri³

et al. 2014

JOM

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This article describes the results of a whisker formation study on SAC305 assemblies, evaluating the effects of lead-frame materials and cleanliness in different environments: low-stress simulated power cycling (50-85°C thermal cycling), thermal shock (-55°C to 85°C), and high temperature/high humidity (85°C/85% RH). Cleaned and contaminated small outline transistors, large leaded quad flat packs (QFP), plastic leaded chip carrier packages, and solder balls with and without rare earth elements (REE) were soldered to custom designed test boards with Sn3Ag0.5Cu (SAC305) solder. After assembly, all the boards were cleaned, and half of them were recontaminated (1.56 lg/cm 2 Cl À ). Whisker length, diameter, and density were measured. Detailed metallurgical analysis on components before assembly and on solder joints before and after testing was performed. It was found that whiskers grow from solder joint fillets, where the thickness is less than 25 lm, unless REE was present. The influence of lead-frame and solder ball material, microstructure, cleanliness, and environment on whisker characteristics is discussed. This article provides detailed metallurgical observations and select whisker length data obtained during this multiyear testing program.

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Annotated tin whisker bibliography and anthology

Cited by 193 publications

References 49 publications

Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment

Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

Whisker Formation on SAC305 Soldered Assemblies

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