1999
DOI: 10.1051/epjap:1999114
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Annealing of radiation damage in MOS devices: Study by diode parameter determination

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Cited by 4 publications
(5 citation statements)
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“…1 that a significant reduction in the amount of charges is obtained with an annealing process even at 100 • C. This is showing that the charges created by the ionizing radiation can be removed by an easy neutralization process that is enhanced by a low-temperature annealing. One of the possible mechanisms might be heat-assisted tunneling of electrons from the substrate into the trapped positive charges in the oxide [24]. We also studied the effect of different annealing ambient and observed no difference between annealing under H 2 and N 2 .…”
Section: Resultsmentioning
confidence: 85%
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“…1 that a significant reduction in the amount of charges is obtained with an annealing process even at 100 • C. This is showing that the charges created by the ionizing radiation can be removed by an easy neutralization process that is enhanced by a low-temperature annealing. One of the possible mechanisms might be heat-assisted tunneling of electrons from the substrate into the trapped positive charges in the oxide [24]. We also studied the effect of different annealing ambient and observed no difference between annealing under H 2 and N 2 .…”
Section: Resultsmentioning
confidence: 85%
“…The gate bias during irradiation enhances this range and supply to measure a few microgray as lower limit and 300 Gy as upper limit. It is widely accepted that there are two different contributions to the flat band voltage shift, one is attributed to oxide-trapped charge and the other is interface-trapped charge [24]. An evaluation of the interface state charges is given below.…”
Section: Resultsmentioning
confidence: 99%
“…3 shows a typical C-V behavior of the MOS capacitors before and after the gamma irradiation. It is widely accepted that there are two different contributions to the flat band-voltage shift, one is attributed to oxide-trapped charge and the other is interface trapped-charge [24].…”
Section: Resultsmentioning
confidence: 99%
“…But, in the case of nMOS transistors, the threshold voltage decreased with absorbed dose up to certain doses (of about 200 Gy [5]), and then increased as a result of rapid increase of negatively charged interface states. Figure 4 shows the calculated threshold voltage change th V ∆ as a function of radiation dose (lines) and experimentally determined values (dots) for n-channel power MOS HEXFETs as reported in [12]. Also, in Above doses of about100 Gy , the density of negatively charged acceptors at the SiO 2 /Si interface is not negligible and this results in a turnaround (or 'rebound') of the th V ∆ .…”
Section: Threshold Voltage Shiftmentioning
confidence: 98%
“…Calculated and experimentally determined threshold voltage shift and contribution of oxide charge and interface traps vs. dose for n-channel power MOS HEXFET. Experimental results are used from[12].…”
mentioning
confidence: 99%