Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition

Lu, Tien Lin; Shen, Yu-An; Wu, John A.; Chen, Chih

doi:10.3390/ma13010134

Cited by 12 publications

(3 citation statements)

References 37 publications

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“…Recently, different Cu plating additives could change the microstructures of electroplated Cu. [15][16][17] Σ3 twinned Cu has several properties applied for electronic packaging, [18][19][20] such as great mechanical strength and thermal stability, [21][22][23] history-independent cyclic response, 24 and good resistance against electromigration. 25,26 One of these properties is to serve as a vacancy sink.…”

mentioning

confidence: 99%

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Chiang

Shen

Feng

et al. 2020

J. Electrochem. Soc.

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Electrodeposition of Cu receives considerable attention due to its wide application in microelectronic products. Sn-rich alloys are commonly used to join the electroplated Cu to form solder joints, while their interactions give rise to undesired Kirkendall voids. Suppression of voids is imperative to ensure reliable solder joints with mechanical robustness. In this study, twinned Cu with various crystal orientations are constructed using electroplating and their efficacy on void suppression are investigated. Four Cu electroplated films (Cu A, B, C, and D) with numerous twin boundaries and different (111) and (110) ratios are joined with Sn-rich solder (SAC305) and thermally aged at 200 °C. The voiding propensity is in an order of Cu D > Cu C > Cu B > Cu A, inversely corresponding to their (111) ratios (Cu A > Cu B > Cu C > Cu D). Particularly, a void-free solder joint constructed by the electroplated Cu A film with plenty of twinned bamboo structures is observed. The findings demonstrate that Σ3 twin boundary in the bamboo structure with 〈111〉-preferred orientation has much higher efficiency at suppressing the Kirkendall effect than that in 〈110〉-preferred Cu films.

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mentioning

confidence: 99%

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Chiang

Shen

Feng

et al. 2020

J. Electrochem. Soc.

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“…(111) Nanotwinned copper thin film specimens.-The nanotwinned copper thin film wafer specimens used in this study are prepared at the Advanced Packaging & Metallization Lab, National Yang Ming Chiao Tung University, Hsinchu, Taiwan. [2][3][4][5][6] Hsinchu, Taiwan. The (111) oriented nanotwinned copper is fabricated by direct current electroplating on a silicon wafer.…”

Section: Methodsmentioning

confidence: 99%

“…In recent years considerable research work is dedicated to developing nanotwinned copper thin films because of their various advantageous properties. [1][2][3][4][5][6][7][8][9][10] The nanotwinned structure has the potential for enhancing the mechanical properties of metals. Additionally, the nanotwinned structure has high thermal stability and lower oxidation.…”

mentioning

confidence: 99%

Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions

Sharma¹,

Chen²,

Chen³

et al. 2022

ECS J. Solid State Sci. Technol.

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Nanotwinned copper possesses a distinctive structure with higher mechanical strength and stability without compromising on resistivity. This study aimed to characterize the nanomechanical properties along with the scratch hardness of the (111) nanotwinned copper thin film wafer in ambient and slurry conditions by triboindenter. Experiments were performed on Hysitron TI 980 Triboindenter using Berkovich and conical indenter for nanoindentation and nano scratch, respectively. We studied the impact of nanotwinned structures on quasistatic and scratch hardness of copper thin film wafers given the potential applicability of nanotwinned copper thin films as interconnects. CMP was extensively applied to obtain the nanoscale surface finish required in the semiconductor micro-nano fabrication industry. The nanomechanical properties of (111) nanotwinned copper thin film wafer with passivation in polishing slurry conditions were imperative parameters to study the polishing behavior of material. Hardness, Young's modulus, and scratch hardness of the nanotwinned copper thin film specimens were evaluated by nanoindenter in ambient and slurry conditions. Results of this study with characteristic parameters of (111) nanotwinned copper thin film wafer can be further used to estimate the material removal of chemical mechanical polishing for high volume production of IC devices in future work.

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Randomly‐Oriented and (111) Uni‐directionally‐Oriented Nanotwin Copper

2021

Electronic Packaging Science and Technology

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Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition

Cited by 12 publications

References 37 publications

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions

Randomly‐Oriented and (111) Uni‐directionally‐Oriented Nanotwin Copper

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