Anisotropic conductive adhesives in electronics

Vries, J.W.C. de; Caers, J.F.J.M.

doi:10.1533/9780857092892.1.53

Cited by 3 publications

(1 citation statement)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Commercially available ACFs, which consist of thermoset resins and solid conductive fillers, require heating and successive compression to form highly conductive vertical paths with simultaneous insulation between terminals in parallel for interconnections in electronics. [22,23] However, these conventional ACFs are less compatible with freeform electronics due to their heating process (typically 110-200 °C), which can cause thermal expansions or degradations in soft, stretchable substrates thereby resulting in significant mismatches against the fine-pitch assembly. [24] Therefore, the development of alternative ACFs that can be applied with negligible heating is essential in soft and freeform electronic systems.Recent advances in wearable electronics with soft and freeform structures demand their outstanding deformability in daily life.…”

mentioning

confidence: 99%

Self‐Healable, Recyclable Anisotropic Conductive Films of Liquid Metal‐Gelatin Hybrids for Soft Electronics

Park

Jang

Kim

et al. 2021

Adv Elect Materials

View full text Add to dashboard Cite

This paper reports an unconventional approach for the formation of self‐healable and recyclable anisotropic conductive films (ACFs) using soft composites of gelatin hydrogels and liquid metals (LMs). The capsules of LMs dispersed inside the gelatin matrix can present satisfactory anisotropic conductance for electrical connections of vertically aligned, fine electrodes at room temperature by applying compressive pressures. The minimization of the capsule size as well as the softness of these LM‐gelatin hybrid ACFs enables high‐resolution integrations of deformable electronic systems, which can increase the integrity of freeform devices. In addition, the good fluidity of LMs and strong hydrogen bonding in gelatin enable these ACFs to be self‐healable at ambient conditions and even recyclable with no significant degradations in either their original electrical or mechanical properties. The utilization of these ACFs to integrate multiple interconnections of micro‐light‐emitting diode arrays on a soft elastomeric substrate demonstrates a stretchable display with its reliable operations during mechanical deformations, suggesting a promising strategy for next‐generation freeform and eco‐friendly green electronics.

show abstract

mentioning

confidence: 99%