Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

Briegel, R.; Ashauer, M.; Ashauer, H.; Sandmaier, H.; Lang, Walter

doi:10.1016/s0924-4247(01)00845-7

Cited by 10 publications

(3 citation statements)

References 3 publications

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“…This allows bio-materials and other highly temperature sensitive materials to be used, and minimizes the thermal expansion mismatch between wafers of different materials. There are many examples [1][2][3][4] of devices that would benefit from the improvement of interlayer-free, low temperature silicon to silicon wafer bonding.…”

Section: Introductionmentioning

confidence: 99%

Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge

Kowal

Nixon

Aitken

et al. 2009

Sensors and Actuators A: Physical

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A new method of exposing silicon/semiconductor wafers to a mixture of radicals is described, in which these species are generated in an oxygen-rich gas discharge confined between a concentric pair of annular mesh electrodes surrounding the wafers. This approach allows the wafer surfaces to be treated without damage from the energetic ions, strong electric fields, and high UV fluxes associated with direct treatment by exposure to gas discharge plasmas. The process is compared with direct oxygen plasma activation for its latitude with respect to treatment duration, effect on wafer surface roughness and bond strength. Wider process latitude and reduced surface roughening are obtained for treatment by radicals compared with direct plasma exposure. Comparative analysis of treated and untreated silicon surfaces by X-ray photoelectron spectroscopy indicate that traces of fluorine present on the wafer surface before treatment are removed with great efficiency by the process.

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Section: Introductionmentioning

confidence: 99%

Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge

Kowal

Nixon

Aitken

et al. 2009

Sensors and Actuators A: Physical

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“…The capping of poly(methyl methacrylate)-poly(methacrylic acid) latex spheres with a semiconductor (CdS) or metal (Ag) was accomplished directly in the electrical double layer of the microspheres, which were later used in the fabrication of photonic crystals [9]. Phadtare et al demonstrated the direct assembly of colloidal gold on polyurethane spheres [10]. They also reported the fabrication of gold shells on polystyrene (PS) cores.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Polydivinylbenzene/Au Core-Shell Beads

Phan

Cho

Nam

et al. 2006

KEM

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A novel core-shell material composed of closely packed gold shells on poly (divinylbenzene) (PDVB) cores was fabricated via the reduction of a gold complex. PDVB beads (2-5 +m) were synthesized by precipitation polymerization. The surface of the PDVB beads was modified by three different methods, viz. sulfonation, chloromethylation, and thiolation. The modification of the surface of the PDVB beads was designed to allow the facile attachment of the gold layer onto the PDVB cores. The gold seeding layer was initially formed on the modified PDVB cores by the chemical reduction of a gold-phenanthroline complex. The subsequent growing reactions of NH2OH and HAuCl4 increased the gold coverage to more than 90%. The structure of the PDVB/Au core-shell material was characterized by SEM, XPS, and FT-IR.

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“…[1][2][3] Not only the environmental issues, conductive adhesives have several advantages compared to conventional solder, such as simpler processing than wave soldering, less thermo-mechanical residual stress, lower processing temperature and high-resolution capability for fine-pitch interconnection. [4][5][6][7][8][9][10][11] The electrical properties of conventional conductive adhesives are generally explained by the percolation theory: when a sufficient amount of conducting filler metals is loaded into an insulating matrix, the composite transforms from an insulator into a conductor. That is, as the filler concentration in the polymer matrix is varied, the conductivity exhibits an insulator-to-conductor transition that is interpreted as a percolation threshold.…”

Section: Introductionmentioning

confidence: 99%

Electrical Characteristics of a New Class of Conductive Adhesive

et al. 2005

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Conventional conductive adhesives are composed of micro-sized filler metal and polymer matrix. Currently, the conductivity of conventional conductive adhesives is generated by small contact points formed among the particles during the curing process and by the tunneling effect. Therefore, conventional conductive adhesives generally exhibit higher electrical resistance than metal solder materials. In this study, a new class of conductive adhesive, composed of nano-particles and micro-particles in epoxy, was developed to improve electrical conductivity. This study used four conventional conductive adhesives (CCA1 to 4) and three hybrid conductive adhesives (HCA1 to 3). Scanning electron microscopy (SEM) observation was used to investigate the configuration of nano-particles and micro-particles. The electrical resistance of HCA1 to 3 was investigated and compared to CCA1 to 4 using a four-point probe method. When 2 mass% of nano-particle content was added to the micro-particle (HCA1), the electrical resistance decreased compared to CCA3. At 4 mass% of nano-particle content (HCA2), the electrical resistance value was similar to CCA3. However, at 8 mass% of nano-particle content (HCA3), the electrical resistance continued to increase, and exceeded that of CCA3.

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Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

Cited by 10 publications

References 3 publications

Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge

Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge

Preparation of Polydivinylbenzene/Au Core-Shell Beads

Electrical Characteristics of a New Class of Conductive Adhesive

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