Angular laser cleaning for effective removal of particles. from a solid surface

Lee, J.M.; Watkins, Ken; Steen, W. M.

doi:10.1007/s003390000583

Cited by 60 publications

(16 citation statements)

References 1 publication

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“…Faster cleaning is possible as the laser imprint covers large area. However highest cleaning rate was obtained at angles less than 30° [67,69]. Laser shock cleaning: In this method, the laser beam does not interact with the surface directly.…”

Section: E Laser Cleaningmentioning

confidence: 99%

A Short Review on Alternative Cleaning Methods to Remove Scale and Oxide from the Jet Engine Alloys

Muthukumar¹

2015

IJERT

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The hot section of the aircraft engine (e.g.: stator casing, turbine blades, etc.,) often gets contaminated with the scale, soil and dirt during its operation. These contaminations adhere strongly to the surface along with oxide build up due to the very high operating temperatures. It severely affects the performance of the gas turbine engine by decreasing its efficiency. As of now, chemical cleaning is the most widely used method by the engine manufacturers and maintenance service providers around the world to restore the material aesthetics and efficiency. Though there are number of cleaning chemistry which could successfully remove these contamination's from the surface, major shortcomings like processing time, disposal (some solvents and chemicals are toxic and not environmental friendly, requires special disposal procedures), user's health & safety and efficiency in cleaning the complex geometries and large parts makes the manufacturers and maintenance service providers to look for alternative cleaning methods. In this paper, some of the commercially available alternative cleaning methods are discussed along with their working principle, capabilities, applications, advantages and disadvantages.

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Section: E Laser Cleaningmentioning

confidence: 99%

A Short Review on Alternative Cleaning Methods to Remove Scale and Oxide from the Jet Engine Alloys

Muthukumar¹

2015

IJERT

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“…New and more detailed research works were done by Halfpenny (1999; ; Wu (1999aWu ( , b, 2000; G. Veerecke (1999 a, b, 2000) and other groups (for example, She (1999); Kim (2001);Yavas (2000);Feng (1999);Schmidt (1999); Lee (2000Lee ( , 2001; Cetinkaya (2000); Luk'yanchuk ( , 2002 Werner Zapka (Chapter 1) introduces the history of the discovery of laser cleaning and Andrew Tam's role in these studies. The three consequent parts of the book are devoted to dry and steam laser cleaning and laser cleaning of artworks.…”

Section: Prefacementioning

confidence: 99%

Front Matter

'yanchuk

2002

Laser Cleaning

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“…[2][3][4][5][6][7] The direct irradiation of laser to surface easily caused surface damage even though it could remove small particles from surfaces.…”

Section: Introductionmentioning

confidence: 99%

Nano-particle laser removal from silicon wafers

Lee

Cho

Kim

et al. 2003

Fourth International Symposium on Laser Precision Microfabrication

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A laser shock cleaning (LSC) technique as a new dry cleaning methodology has been applied to remove micro and nano-scale inorganic particulate contaminants. Shock wave is generated in the air just above the wafer surface by focusing intensive laser beam. The velocity of shock wave can be controlled to 10,000 mlsec. The sub-micron sized silica and alumina particles are attempted to remove from bare silicon wafer surfaces. More than 95% of removal efficiency of the both particles are carriend out by the laser-induced airborne shock waves. In the final, a removal of nano-scale slurry particles from real patterned wafers are successfully demonstrated by LSC after chemical-mechanical polishing (CMP) process.

show abstract

Angular laser cleaning for effective removal of particles. from a solid surface

Cited by 60 publications

References 1 publication

A Short Review on Alternative Cleaning Methods to Remove Scale and Oxide from the Jet Engine Alloys

A Short Review on Alternative Cleaning Methods to Remove Scale and Oxide from the Jet Engine Alloys

Front Matter

Nano-particle laser removal from silicon wafers

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