Analyzing the Physical Properties of Polymer-Loaded Phenolic Resin

Abstract

This research interrogates the effect of loading phenolic resin (\({C}_{8}{H}_{6}{O}_{2}\)) and graphene oxide (GO) solutions into a polyethersulphone (PES) matrix to improve the physio-mechanical properties of PES. A new class of thin-film was successfully synthesized by incorporation of phenolic resin (\({C}_{8}{H}_{6}{O}_{2}\)) and graphene oxide (GO) solutions into a 2 wt% polyethersulphone (PES) matrix and its application in pharma packaging was investigated. To alter the mechanical properties of the thin films, a mixture of phenolic resin and graphene oxide was dispersed into a prepared polyethersulphone solution at varying concentrations using a solution mixing technique. the XRD spectra for PES/GO/PR thin films to confirm the presence of GO. The sharp peak was observed at 2θ = 19.79˚. The tensile testing of the polyethersulphone composite thin films revealed an increase in the tensile strength, which rose from 3.74 to 33.91 MPa, and Young's modulus was also improved from 9.97 to 20.85 MPa. Additionally, there was a significant improvement in the percentage elongation, which rose from 1.02 to 1.66% for PC-4, indicating a strong agreement between the filler used and the composition method.