Analytical Solutions of Heat Transfer and Film Thickness with Slip Condition Effect in Thin-Film Evaporation for Two-Phase Flow in Microchannel

Abstract

Physical and mathematical model has been developed to predict the two-phase flow and heat transfer in a microchannel with evaporative heat transfer. Sample solutions to the model were obtained for both analytical analysis and numerical analysis. It is assumed that the capillary pressure is neglected (Morris, 2003). Results are provided for liquid film thickness, total heat flux, and evaporating heat flux distribution. In addition to the sample calculations that were used to illustrate the transport characteristics, computations based on the current model were performed to generate results for comparisons with the analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). The calculated results from the current model match closely with those of analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region and develop an analytical equation for evaporating liquid film thickness.

Computational Study of Liquid Film Evaporation along a Wavy Wall of a Vertical Channel

“…(6) Calculate the relative error it of the liquid film mass balance using (17). (7) A better approximation to the liquid film thickness is then obtained using the secant method.…”

“…The results were presented for glycols and ethanol liquid films evaporation for insulated, heated, and partially heated walls. Heat and mass transfer in thin liquid film over stretching surface is deeply examined by Shkarah et al [17]. The analytical solutions permitted us to calculate the distribution of the heat flux and the evaporating liquid film thickness in a microchannel.…”