Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar

Hsieh, Shou-Shing; Lee, Ron-Yu; Shyu, Jin‐Cherng; Chen, Shaowen

doi:10.1016/j.enconman.2007.04.022

Cited by 36 publications

(7 citation statements)

References 8 publications

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“…However, the thermal performance worsens as the thermal resistance increases. The spreading thermal resistance R s of the heat sink is the resistance that is encountered when the heat is transferred from the heating element, which has a smaller area, through the base plate of the heat sink, which has a larger area, to the top surface of the base plate [4]. The convective thermal resistance R c of the heat sink, which is the resistance that is encountered when the heat is transferred from the top surface of the base plate through the heat sink to the cooling air, is given by…”

Section: Experimental Apparatus and Methodsmentioning

confidence: 99%

“…The surface temperature distribution of the vapor chamber was more uniform than the metal plate and less sensitive to the heat source size and the input power. Hsieh et al [4,5] presented analytical and experimental results concerning the thermal performance of a vapor chamber. They concluded that a vapor chamber without a pillar outperformed one with a pillar, and that the vapor chamber is a favorable alternative to the traditional solid metal heat sink.…”

Section: Introductionmentioning

confidence: 99%

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Effects of shield on thermal-fluid performance of vapor chamber heat sink

Chiang

2011

International Journal of Heat and Mass Transfer

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Section: Experimental Apparatus and Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of shield on thermal-fluid performance of vapor chamber heat sink

Chiang

2011

International Journal of Heat and Mass Transfer

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“…While these models only predict steady state performance, and do not capture spatial flow characteristics and operating limits, they enable first-order design for multiple working fluids and different power dissipation levels, and selection of favorable vapor chamber form factors [95], at reasonable accuracy compared to complex, three-dimensional analytical solutions [96]. Additional predictive capabilities can be incorporated into these modeling schemes as necessary.…”

Section: Analytical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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“…The heat transfer characteristics of the vapor chamber have been widely studied by researchers. Hsieh et al [1] analyzed the thermal resistance of vapor chamber heat sink with and without pillar for electronic cooling. Hu and Tang [2] investigated the flow and thermal characteristics of a microphase-change cooling system with a microgroove evaporator.…”

Section: Introductionmentioning

confidence: 99%