Analytical Models of High-Speed RLC Interconnect Delay for Complex and Real Poles

Ullah, Muhammad Sana; Chowdhury, Masud H.

doi:10.1109/tvlsi.2017.2654921

Cited by 30 publications

(10 citation statements)

References 44 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This latter will be considered in the following part of this work to model the electromagnetic interaction phenomena of the interconnections in an integrated circuit. For solving the potential magnetic vector propagation equation, considering the finite element formulation, we have introduced the Galerkin method [14] defined in a Cartesian coordinate system. The propagation is considered according to the oz axis, by considering the phenomenon is governed by the equation:…”

Section: The Mathematical Modelmentioning

confidence: 99%

“…This requires specific tools, models and EMC knowledge [12,13]. The designer of integrated circuits should consider the capacitances and inductances that were not considered in earlier times, because of the interconnection's lengths and the higher operating frequencies [14,15]. The study of electromagnetic radiation in an integrated circuit requires knowledge of the electromagnetic fields in this device and therefore the flux values [16].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Investigation on EM radiations from interconnects in integrated circuits

2020

View full text Add to dashboard Cite

Characterization and estimation of interconnections behavior in integrated circuits design before the implementation phase is of paramount importance. This behavior seen as microstrip antennas gets complex as the internal signal (square or sine waves) frequencies increase. Thus, they become the preferred path for the propagation of electromagnetic disturbances. In this work we have worked out the numerical modeling of the electromagnetic interactions characterizing the electromagnetic compatibility in the microstrip transmission lines. The effect of these electromagnetic interactions in different structures topologies are studied through the analysis of the influence of the supply signals frequency and structures. The spacing between transmission line tracks and the number of tracks superposition is modeled. The evolution and variation of the scheme parameters in the frequency domain are determined. The transmission lines are considered parallel of equal spacing and superposed tracks of equal spacing and thickness. The capacitance and inductance matrices are computed and discussed. The results are found to comply with current research outcomes.

show abstract

Section: The Mathematical Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Investigation on EM radiations from interconnects in integrated circuits

2020

View full text Add to dashboard Cite

show abstract

“…Using the above calculated value for f s in conjunction with (15), and substituting R′ f for R′ in the classical transmission line equations yields the upper dashed attenuation versus frequency curve in the comparative plots of Fig. 9.…”

Section: Compact Hf Model Versus Classical Theory In Hf Regionmentioning

confidence: 99%

“…As serial data‐rates have continued to climb over time we have witnessed a necessary increase in attention given to the signal degradation introduced by ever smaller interconnect structures, starting at the PCB level [7, 8], with a later focus moving to the packaging [8, 9], and more recently to on‐chip structures in the higher metal levels where the

R^{'} / L^{'}

transition frequencies now fall within transmission signal bandwidth and consequently analysis no longer yields to a simpler distributed RC model approach [10–15]. In the case of such small structures operating at sufficiently high frequencies it is apparent that they must be treated as sub‐miniature transmission lines, and whereas for such structures the classical equations will generally be found to be sufficiently accurate over a wide range of operating frequency, nevertheless, as signal frequencies continue to increase these small structures can also be anticipated to require a correction applied to the classical equations for the same high‐frequency effects as described earlier.…”

Section: Classical‐compact Hybrid Modelmentioning

confidence: 99%

Approach to modelling uniform transmission lines for broadband high‐frequency applications

Webster

2020

IET Circuits, Devices & Systems

View full text Add to dashboard Cite

A novel high-frequency lossy uniform transmission line model is presented in this study. Novel features include a compactness of form and a level of simplicity that confers enhanced simulation efficiency in practical applications. Although specifically developed to target implementation in generic versions of SPICE, the compact high-frequency model can be implemented using only four lines of netlist syntax in the case of circuit simulators that offer native Laplace equation support. Featuring a broadband frequency response characteristic that is defined by only four parameters, the compact HF model is based on a novel theoretical approach that elegantly connects the four model parameters to physical line parameters using only elementary line characterisation data. Important and perhaps surprising differences between the new model theory and classical textbook theory are highlighted and discussed. The lessons learned are then incorporated into a second hybrid model featuring a higher level of complexity that combines both new and classical theoretical approaches into a single set of model equations that are better suited for atypically small controlled impedance structures such as silicon interposers and on-chip clock and data distribution schemes.

show abstract

“…The articles [1][2] revealed effects of on-chip self-inductance and then proposed methods for screening interconnects which should be treated as RLC models [5] [6], rather than the conventional RC expressions [7]. As for the recent System-on-a-Chip (SoC) applications including 4K8K HDTV processing [8], processor cores need more speed to complete the required operations.…”

Section: Introductionmentioning

confidence: 99%

Impact of mutual inductance on timing in nano-scale SoC

Sakata

Hasegawa²,

Ichikawa

et al. 2018

IEICE Electron. Express

View full text Add to dashboard Cite

This paper investigates the impact of mutual inductance (M ) on interconnect signal delay estimation according to resistance (R), inductance(L), and capacitance(C) in nano-scale system on a chip (SoC), suggesting a method to predict and suppress the impact. The proposed methodology first calculates the difference in delay between RLC and RLM C wire models for a set of parameter variations, then builds response surface functions (RSF) using physical parameters including wire width and spacing. The proposed method contributes to the following actions. 1) Describe design rules to avoid mutual inductance effects. 2) Select wires which require RLM C models for delay estimation 3) Correct the estimated delay when using an RLC model. As an example, situations to limit the mutual inductance effect is shown as to a 14nm technology node.

show abstract

Analytical Models of High-Speed RLC Interconnect Delay for Complex and Real Poles

Cited by 30 publications

References 44 publications

Investigation on EM radiations from interconnects in integrated circuits

Investigation on EM radiations from interconnects in integrated circuits

Approach to modelling uniform transmission lines for broadband high‐frequency applications

Impact of mutual inductance on timing in nano-scale SoC

Contact Info

Product

Resources

About