2011
DOI: 10.1109/led.2011.2164229
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Analytical Models for Drain Current and Gate Capacitance in Amorphous InGaZnO Thin-Film Transistors With Effective Carrier Density

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Cited by 43 publications
(18 citation statements)
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“…In the amorphous TFTs, the field effect mobility is dominated by the amount of free carriers (Q f ree ) in the channel which is strongly dependent on the gate voltage (V gs ) and threshold voltage [9], [10]:…”
Section: B Pre-breakdown Degradation Due To Tlp Stressmentioning
confidence: 99%
“…In the amorphous TFTs, the field effect mobility is dominated by the amount of free carriers (Q f ree ) in the channel which is strongly dependent on the gate voltage (V gs ) and threshold voltage [9], [10]:…”
Section: B Pre-breakdown Degradation Due To Tlp Stressmentioning
confidence: 99%
“…Here, we found that two factors, i.e., the Schottky-contact and the Poole-Frenkel mobility, needed to be taken into account in addition to the conventional mobility edge model. Thus we improved the DOS-based analytical I-V and C-V models [6] by employing a Schottky diode, the depletion capacitance, and the Poole-Frenkel mobility, as summarized in Table 1. In detail, the S/D contacts were modeled as back-to-back connected Schottky diodes.…”
Section: Analytical I-v and C-v Modelsmentioning
confidence: 99%
“…8(b)], which means that the detailed non-linearity of PTFTs is successfully reproduced with the improved analytical model. The analytical C-V model was also improved from [6] by adding the depletion capacitance (C dep ) for the depletion region of the active layer. It is consistent with the back-to-back Schottky contact model (Fig.…”
Section: Analytical I-v and C-v Modelsmentioning
confidence: 99%
“…For the circuit simulation, an analytical I-V and C-V model were established by modifying our previous n-type metal oxide TFT model [9] into the p-type counterpart. The equations of I-V and C-V model were basically similar to [9], and the parameterextracting procedure was illustrated in Fig. 2.…”
Section: Analytical Model and Its Incorporation Into Circuit Simulationmentioning
confidence: 99%