Analysis on vertical directional couplers with long range surface plasmons for multilayer optical routing

Alam, Badrul; Veroli, Andrea; Benedetti, Alessio

doi:10.1063/1.4961419

Cited by 13 publications

(6 citation statements)

References 29 publications

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“…Optical NoCs have the benefit of large bandwidths, low propagation losses and integrability, although they are limited by their planar nature since the number of crossings between waveguides corresponds to losses and crosstalk [3][4][5]. Although there are efforts for the integration of a 3D interconnection system [6][7], a stable technological solution is yet to be defined. Wireless NoCs [8][9] have the benefit of reducing routing complexity of wires, although they involve the use of multiple modules of transceivers, with the related modulation/demodulation, power sources for transmitters, and bulky antennas (working at microwaves).…”

Section: Introductionmentioning

confidence: 99%

Numerical and Experimental Analysis of On-Chip Optical Wireless Links in Presence of Obstacles

et al. 2021

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Section: Introductionmentioning

confidence: 99%

Numerical and Experimental Analysis of On-Chip Optical Wireless Links in Presence of Obstacles

et al. 2021

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“…Furthermore, cross-talk risks threaten (O)NoC design, to an extent that becomes harsher as the number of processing elements increases and the network deployment becomes more tangled. 3D integration, where the vertical dimension is also exploited to stack different circuit components, can be a viable solution in some specific situations [7], but fabrication issues limit the implementation of on-chip multi-planar layouts on the mainstream technologies as Silicon Photonics.…”

Section: Introductionmentioning

confidence: 99%

Multi-Level Analysis of On-Chip Optical Wireless Links

et al. 2019

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Networks-on-chip are being regarded as a promising solution to meet the on-going requirement for higher and higher computation capacity. In view of future kilo-cores architectures, electrical wired connections are likely to become inefficient and alternative technologies are being widely investigated. Wireless communications on chip may be therefore leveraged to overcome the bottleneck of physical interconnections. This work deals with wireless networks-on-chip at optical frequencies, which can simplify the network layout and reduce the communication latency, easing the antenna on-chip integration process at the same time. On the other end, optical wireless communication on-chip can be limited by the heavy propagation losses and the possible cross-link interference. Assessment of the optical wireless network in terms of bit error probability and maximum communication range is here investigated through a multi-level approach. Manifold aspects, concurring to the final system performance, are simultaneously taken into account, like the antenna radiation properties, the data-rate of the core-to core communication, the geometrical and electromagnetic layout of the chip and the noise and interference level. Simulations results suggest that communication up to some hundreds of μm can be pursued provided that the antenna design and/or the target data-rate are carefully tailored to the actual layout of the chip.

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“…One of the most promising solutions to overcome of the inter-and intra-chip communication bottleneck is the on-chip integration of photonic components [1]. A large number of integrated photonic and plasmonic devices have been proposed as building blocks for routing the signal in complex photonic networks [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%