2008 Asia Simulation Conference - 7th International Conference on System Simulation and Scientific Computing 2008
DOI: 10.1109/asc-icsc.2008.4675580
|View full text |Cite
|
Sign up to set email alerts
|

Analysis on the parameters of adhesively bonding patch repairing cracked sandwich face panel

Abstract: The parameters of adhesively bonding patch, which include patch materials, patch size, patch thickness, have been analyzed on the stress concentration factor and the stress intensity factor (SIF) thanks to the 3D finite element method (FEM) in the paper. The adhesive shear modulus and thickness are studied in this paper as well. The aluminum sandwich face panel is analyzed and the results show that the Boron/Epoxy composite patch reduces more stress concentration factor and SIF comparing with the other patches… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 5 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?