Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications

Zhu, Lin; Tan, Hongbo; Yu, Jianlin

doi:10.1016/j.enconman.2013.08.014

Cited by 116 publications

(27 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…First, TE module design and optimization, such as number of thermocouples [63][64][65][66], thermoelement length [67][68][69][70] and thermoelement length to cross-sectional area ratio [71][72][73]. Second, cooling system thermal design and optimization [74], which includes investigation of heat sinks' geometry [75][76][77], identification of the heat transfer area and heat transfer coefficients of both hot and cold side heat sinks [78][79][80], more effective heat sinks (i.e. heat sink integrated with thermosyphon and phase change material) [16,81,82], thermal and electrical contact resistances and interface layer analysis [83][84][85].…”

Section: Modeling Approaches For Thermoelectric Coolingmentioning

confidence: 99%

Thermoelectric Cooling

Atta¹

2018

Bringing Thermoelectricity Into Reality

View full text Add to dashboard Cite

In this chapter, design and analysis study of thermoelectric cooling systems are described. Thermoelectric (TE) cooling technology has many advantages over the conventional vapor-compression cooling systems. These include: they are more compacted devices with less maintenance necessities, have lower levels of vibration and noise, and have a more precise control over the temperature. These advantages have encouraged the development of new applications in the market. It is likely to use TE modules for cooling the indoor air and hence compete with conventional airconditioning systems. These systems can include both cooling and heating of the conditioned space. In order to improve the performance of the TE cooling systems, the hot side of the TE should be directly connected to efficient heat exchangers for dissipation of the excessive heat. Finally, TE cooling systems can be supplied directly by photovoltaic to produce the required power to run these cooling systems.

show abstract

Section: Modeling Approaches For Thermoelectric Coolingmentioning

confidence: 99%

Thermoelectric Cooling

Atta¹

2018

Bringing Thermoelectricity Into Reality

View full text Add to dashboard Cite

show abstract

“…ペルチェ素子は電圧を加えると，一方の面から他方の面へ熱移動が生じる薄型板状の熱電変換デバイスである．対象物への局所的な温度制御が可能であり，コンプレッサなどの可動部が存在しないため，モジュールがコンパクトという特徴から，生体の治療用冷却装置としての応用が期待されている， (Zhu et al, 2013)．しかし，これらの方法は，ある特定の条件下で使用した場合におけるペルチェ素子の放熱量の推定や，エネルギー効率を表す成績係数(COP)を考慮した最適な駆動電流値・電圧値の算出には効果的であるが，ペルチェ素子両面温度の過渡・定常応答を精度良く模擬することができない．そこで，ペルチェ素子販売メーカーにより提供される公称的な情報より，ペルチェ素子内部の特性パラメータを近似的に推定する方法，や，温度依存性を考慮した特性パラメータの設定方法などが提案されている．前者は，任意の作動条件下で，ペルチェ素子自体の過渡・定常応答をある程度推定することが出来るが，それを冷却装置として使用し，何か対象物を冷やすといった場合の応答の検討は行われていない．後者は，従来の方法と比べ，シミュレーション精度は高いが，かなり複雑な処理が必要となり，汎用性を考慮すると現実的ではない．我々はこれまで，脳疾患の一つであるてんかんの大脳冷却治療を実現するための小型冷却装置の開発を行ってきた , , 1 (a) Device A which is the same size and specification as device B. (b) Device C which uses a larger Peltier element than Device A.…”

Section: 緒言unclassified

Study on model parameters of a focal cooling device using a Peltier element for a living body

Uehara¹,

Mori²,

Saito³

2017

Transactions of the JSME (In Japanese)

View full text Add to dashboard Cite

A Peltier element is considered as a way to enable local temperature control and also has several advantages including rapid thermal response, no vibration and compactness. Therefore, a focal cooling device using a Peltier element for treatment is expected to apply to various parts of a living body. In the design of the device ensuring both the energy efficiency and therapeutic effect, it is necessary to understand the thermoelectric conversion characteristics of the Peltier element and the thermal conductivity of the attachment in the device, which should be designed in accordance with the cooling performance and size. Therefore, the investigation using a mathematical model is believed to play an important role in such case. The purposes of this study are to clarify the characteristics of the model parameters and to investigate whether performance evaluation of the device from its characteristics is possible. Model parameters were identified experimentally using three prototypes of different sizes and cooling abilities. From the result of the parameter identification, internal resistance and thermal conductance of the Peltier device are dependent on the cooling performance. The parameters representing the thermal conductance between each attachment in the device are strongly depend on the size. However, changes of these parameters were smaller than the size ratio of the device. Our results suggest that it can provide useful information to the designer.

show abstract

“…Yang and Wang [8] simulated a 3D transient cooling portable electronic device using phase change material. Zhu et al [9] optimized the heat exchanger size of a thermoelectric cooler used for electronic cooling applications. Gong et al [10] presented numerically on layout of micro-channel heat sink useful for thermal management of electronic devices.…”

Section: Literature Reviewmentioning

confidence: 99%

Numerical Studies on Cooling Of Electronics Module Using Nzo, an and Mg Water Based Nanofluids

Kund¹

2017

IJRASET

View full text Add to dashboard Cite

Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications

Cited by 116 publications

References 18 publications

Thermoelectric Cooling

Thermoelectric Cooling

Study on model parameters of a focal cooling device using a Peltier element for a living body

Numerical Studies on Cooling Of Electronics Module Using Nzo, an and Mg Water Based Nanofluids

Contact Info

Product

Resources

About