Analysis of Thick-Wall Hollow Functionally Graded Material under Temperature and Pressure Loads

Lin, Wen Feng

doi:10.1109/ecice50847.2020.9301914

2020 IEEE Eurasia Conference on IOT, Communication and Engineering (ECICE) 2020

DOI: 10.1109/ecice50847.2020.9301914

|View full text |Cite

Analysis of Thick-Wall Hollow Functionally Graded Material under Temperature and Pressure Loads

Wen Feng Lin

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Publication Types

Select...

Relationship

Self Cite0

Independent0

Authors

Journals

Cited by 0 publications

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

No citations

Set email alert for when this publication receives citations?

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

hi@scite.ai

334 Leonard St

Brooklyn, NY 11211

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Analysis of Thick-Wall Hollow Functionally Graded Material under Temperature and Pressure Loads

Cited by 0 publications

References 10 publications

No citations

Contact Info

Product

Resources

About