Analysis of the structure evolution and crack propagation of Cu-Filled TSV after thermal shock test

Dou, Haixiao; Yang, Miaomiao; Chen, Yanning; Qiao, Yanbin

doi:10.1109/icept.2017.8046528

Cited by 4 publications

(4 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The discretization form can be written as (2), where Ω , , 0 , and denote the element domain, stress boundary, interface region, and interfacial stress.…”

Section: Derivations Of Interface-element Methodsmentioning

confidence: 99%

“…Applying (11) into (2) gives the interface element domain integral, the element stiffness matrix for elasticity, and the traction term which can be evaluated. Finally, the governing equation of IEM is expressed as…”

Section: = [ ] ;mentioning

confidence: 99%

“…One of the major challenges is to improve the thermomechanical reliability when the package is subjected to the thermal loads. However, the conjunct interfaces near the free edge always suffer high stress gradients and even can generate cracks, because the packaging components are fabricated with different thermal and mechanical properties [1,2]. Suhir [3] predicted the thermal stresses in the layered structures.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method

Liu

Chen

Tsai

2018

Mathematical Problems in Engineering

View full text Add to dashboard Cite

In this study, a multiscale interface element method (MIEM) is developed to evaluate the interfacial peel and shear stress distributions in multilayer packaging structures. A newly developed polygon interface element contained many sides that could easily connect with many other polygon elements of much smaller scale. Simple model and less computation can obtain accurate stress distributions. After verification of the validity of the developed model, MIEM is applied to analyze thermal stress distribution of the chip scale package (CSP). In general, a good qualitative agreement has been observed between the various results. Moreover, MIEM can directly obtain the stress value at the interface, which is also one of the advantages of this method in dealing with multilayer structures.

show abstract

“…The discretization form can be written as (2), where Ω , , 0 , and denote the element domain, stress boundary, interface region, and interfacial stress.…”

Section: Derivations Of Interface-element Methodsmentioning

confidence: 99%

Section: = [ ] ;mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method

Liu

Chen

Tsai

2018

Mathematical Problems in Engineering

View full text Add to dashboard Cite

show abstract

“…When the interfacial shear stress is large, fracture at Cu/glass interface occurs. 6 The expansion of the TGV-Cu cylinder and interfacial fracture can lead to the cracks or interface delamination between TGV-Cu and RDL, resulting in high impedance or even open circuit of the device.…”

Section: Failure Mechanismsmentioning

confidence: 99%