2001
DOI: 10.1016/s0017-9310(00)00259-3
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Analysis of the operational characteristics and limits of a loop heat pipe with porous element in the condenser

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Cited by 51 publications
(19 citation statements)
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“…There are only a few works about the numerical investigations. Muraoka and his co-authors developed a mathematical model based on the nodal method and analyzed the operational limits and dry-out failure mechanisms (Muraoka et al, 2001;). Pouzet and his co-authors proposed a global model to study the fundamental response mechanisms subjected to various heat load transients (Pouzet et al, 2004).…”
Section: Fig 1 Cpl Function Schematicmentioning
confidence: 99%
See 1 more Smart Citation
“…There are only a few works about the numerical investigations. Muraoka and his co-authors developed a mathematical model based on the nodal method and analyzed the operational limits and dry-out failure mechanisms (Muraoka et al, 2001;). Pouzet and his co-authors proposed a global model to study the fundamental response mechanisms subjected to various heat load transients (Pouzet et al, 2004).…”
Section: Fig 1 Cpl Function Schematicmentioning
confidence: 99%
“…Capillary Pumped Loop (CPL) is a two-phase heat-transport device, which rely on the surface-tension forces induced by a fine pore wick to drive a working fluid (Muraoka et al, 2001;Cao and Faghri, 1994;Kaya et al, 2008). These devices use the same basic principle of the widely known heat pipes, i.e., closed evaporation-condensation cycle being maintained by capillary pumping.…”
Section: Introductionmentioning
confidence: 99%
“…For example, Kim and Peterson developed a reversible LHP with a condenser wick, but the wick was integrated as an alternate evaporator wick in the reverse operation [15]. Another study by Muraoka et al reported flooded condenser wicks, with a liquid film on the wick surface [16]. To remove the liquid film and form a capillary meniscus at the wick surface, the heat pipe needs to operate with the appropriate liquid and vapor pressures.…”
Section: Introductionmentioning
confidence: 99%
“…Various configurations and features of LHPs are well described in the literature [1][2][3][4][5][6][7][8][9][10]. Owing to its prominent advantages over conventional heat pipes, LHP has the potential to be used widely as efficient cooling devices for high-power electronic components in the near future.…”
Section: Introductionmentioning
confidence: 99%
“…Maidanik and Fershtater [1,2] suggested employing an auxiliary heater as an active temperature control device of the compensation chamber to maintain the temperature of LHP quasi-stable against a certain range of heat-load variation. Muraoka et al [3] investigated bubble formation in the liquid core and its effect on the dry-out failure, using a specific LHP having a porous element in the condenser, and suggested conditions to predict the dry-out. Mo et al [4,5] employed an electro-hydrodynamic technique to induce an additional pressure difference in an effort to reduce the start-up time and thus to enhance the thermal performance of LHP.…”
Section: Introductionmentioning
confidence: 99%