2023 IEEE International Reliability Physics Symposium (IRPS) 2023
DOI: 10.1109/irps48203.2023.10117955
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Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations

Andrea Vici
1
,
R. Degraeve
2
,
Ph. Roussel
3
et al.
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