Analysis of RF transceiver for 5G applications

Punitha, L.; Sugumar, Sathya Priya; Rao, P. Haridas

doi:10.23919/ursiap-rasc.2019.8738422

Cited by 4 publications

(4 citation statements)

References 2 publications

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“…The GaAsSi Chip Implantation consists of twelve (12) Application-Specific-Integrated Circuits (ASICs) each containing 500 to 1000 electrodes. This results in 6, 000 to 12, 000 individually programmable amplifiers and 6,000 to 12,000 channels overall.…”

Section: The Gaassi Architecturementioning

confidence: 99%

“…Sensor is a device, module, machine, or subsystem whose purpose is to detect events or changes in its environment and send the information to other electronics, frequently a computer processor. [12] The Sensor(s) relating to the GaAsSi chips are used for interfacing with the Electrodes causing the external device to speak with the chips and vice versa.…”

Section: Sensor Feedbackmentioning

confidence: 99%

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Brain Machine Interface (BMI) for Spinal Injuries

Allen¹

2020

IJAERS

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Brain-to-machine-interface (BMI) that facilitates the healing of Spinal Injuries. The Product is designed to facilitate the healing of scar tissues along the vertebrae column. This works perfectly for persons having a handicap that hinders motor skills. The BMI performs this operation by generating a series of electromagnetic propagations throughout the vertebrae column. It will also be designed to target specific areas of extreme abrasion(s) that affect proper blood flow to facilitate the easy flow of blood (as before injury), so that patient(s) once again would experience the use of their limbs. The device will be engineered as such to cause the brain, where necessary, to (possibly) adjust its own internal frequencies (in Hz) and pitch (in W s/cm 2 ) to aid in this process. It will be disclosed that through the adjustment of frequencies (in Hz) and energy density (in W s/cm2) scar tissues can be corrected.

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Section: The Gaassi Architecturementioning

confidence: 99%

Section: Sensor Feedbackmentioning

confidence: 99%

Brain Machine Interface (BMI) for Spinal Injuries

Allen¹

2020

IJAERS

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“…In 5G demands, beamforming is also an emerging point for the researchers as in Zhang et al (2019), the high beamforming methods were introduced, but the ADC was not specified for this purpose, which may cause some complexity in fast processing systems. A brief analysis of the 5G RF transceiver was presented in Punitha et al (2019) regarding the operating frequency. Unfortunately, the error detection and correction methods were not discussed for the coding schemes.…”

Section: Introductionmentioning

confidence: 99%

Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications

Faheem

Azeem

Minhas

et al. 2022

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Purpose RF transceiver module is considered a vital part of any wireless communication system. This module consists of two important parts the RF transceiver and analog-to-digital converter (ADC). Usually, both these parts – RF transceiver and ADC – are used to enhance the perspective of size and power. The data processing in 4G communication makes hurdles and need research attention to make it faster and smaller in size. Accuracy and fast processing are the critical challenges in the modern communication system. Design/methodology/approach After theoretical and practical investigations, this research work proposes key new techniques for the RF transceiver module. These techniques will make RF transceiver small, power-efficient and on the other hand, make dual SAR-ADC more effective as well. The proposed design has no intermediate frequency where the RF transceiver is reduced its major blocks from five to four, which includes crystal oscillator, phase lock loop, power amplifier and low noise amplifier. Moreover, the shared circuitry is introduced in the architecture of the SAR-ADC for the production of dual outputs, specifically in bootstrapped switch and comparator. Findings The miniaturized RF transceiver and SAR-ADC are well tested separately before the plantation on the printed circuit board (PCB). The operating voltage and frequency of the RF transceiver module are 1.2 V and 5.8 GHz, where the sampling rate, bandwidth and output power are 25 MHz, 200 MHz and 5 dBm, respectively. The core area of the PCB is 58.13 mm2. The bandwidth efficiency is 93% using surface acoustic wave less transmitter. The circuit is based on the library of 90 nm CMOS technology. Originality/value The entire circuit is highly synchronized with the input and reference clocks to avoid self-interference.

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“…Microwave and millimeter-wave components with reduced complexity and enhanced performance are highly demanded for the new generation of wireless technology such as 5G systems [1]. Reduced complexity mainly includes the planar structures compared to 3D bulky waveguides, single-layer SIW structures in contrast to multi-layer ones, etc.…”

Section: Introductionmentioning

confidence: 99%

Gap-Coupled Dual-Band Evanescent-Mode Substrate Integrated Band-Pass Filter Waveguide

Nosrati¹,

Mohammad-Taheri²,

Nosrati³

2020

PIER Letters

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A single-layer substrate integrated waveguide (SIW) is developed to design a dual-band band-pass filter (BPF) operating below the cutoff frequency of the SIW, known as evanescent-mode excitation. Gap-coupled excitation is used to demonstrate the multiple transmission poles (TPs) and transmission zeros (TZs) below the cutoff frequency of the SIW. The structure is reported to realize two independent evanescent-mode poles on a single-layer SIW which reduces the size and complexity of the structure compared to those of the recent multi-layer evanescent-mode structures. Lumped-element equivalent circuit is employed to describe the EM behavior of the structure for TZs and TPs realization. A compact single-layer dual-band SIW filter is fabricated based on the proposed structure. A good agreement is reported between the measured and simulated performances.

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Analysis of RF transceiver for 5G applications

Cited by 4 publications

References 2 publications

Brain Machine Interface (BMI) for Spinal Injuries

Brain Machine Interface (BMI) for Spinal Injuries

Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications

Gap-Coupled Dual-Band Evanescent-Mode Substrate Integrated Band-Pass Filter Waveguide

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