2008
DOI: 10.1016/j.cap.2007.04.058
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Analysis of resin flow during nano-imprinting lithographic process

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Cited by 5 publications
(4 citation statements)
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“…Regardless of mold rigidity and deployment of resist materials, the resist flow driven by contact pressure during the imprinting stage plays a critical role in nanoimprinting lithography. A lot of research works have been reported before [22][23][24][25][26][27][28] but most of them were focusing on rigid molds as depicted in figures 1(a)-(c). However, the schemes depicted in figures 1(d)-(i) are inherently favorable for nanoimprinting since they provide the contact angle needed for resist flow, avoid air bubble trapping, and have a better chance of conformal mold/substrate contact.…”
Section: Introductionmentioning
confidence: 99%
“…Regardless of mold rigidity and deployment of resist materials, the resist flow driven by contact pressure during the imprinting stage plays a critical role in nanoimprinting lithography. A lot of research works have been reported before [22][23][24][25][26][27][28] but most of them were focusing on rigid molds as depicted in figures 1(a)-(c). However, the schemes depicted in figures 1(d)-(i) are inherently favorable for nanoimprinting since they provide the contact angle needed for resist flow, avoid air bubble trapping, and have a better chance of conformal mold/substrate contact.…”
Section: Introductionmentioning
confidence: 99%
“…Lee et al investigated various polymer filling behaviors including the numerical methods according to the slip boundary condition, dynamic contact angle, pressure and temperature. It was shown that the polymer filling shape could be varied according to the pressure, temperature, and stamp geometry [ 7 , 8 ]. Bonning et al proposed a new simulation technique with a contact mechanical-based approach for thermal NIL.…”
Section: Introductionmentioning
confidence: 99%
“…Originally patented by Stephen Chou [1], contributions to NIL have been made through experiment and numerical analysis by others since [2][3][4][5][6][7][8][9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%