Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Abstract

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

“…Subsequently, the liquefied metal was poured in a specially prepared die to obtain the tensile samples, as shown in Figure 2. In a similar way, the casting process is discussed by Umair Ali et al to prepare the tensile specimens [6]. indium to SAC305 by the resulting hardness of the new alloy.…”

“…Although, the SAC family consists of different doping compositions, which is to be considered as SAC305, SAC405, SAC105, SAC307, SAC396, and SA107 [5]. SAC305 is perceived as the most favorable choice among all these alternatives, while the concern of high cost is due to the high silver content [6]. The SAC105 is renowned for its suitability and attractiveness due to its cost-effectiveness and favorable thermal and mechanical properties [7].…”

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“…Mikostruktur dari sampel dapat dilakukan analisa secara mendalam dengan menggunakan analisis elemen dan pengukuran ketebalan lapisan. Pengukuran ketebalan lapisan dapat merujuk pada warna dan tekstur yang terbentuk [4][5], [6].…”

Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple

“…Electronics find extensive applications across diverse fields, including aerospace, automotive and more. Within the electronic industry, solder plays a crucial role in creating mechanical bonds, physically connecting electronic components to substrates and facilitating the flow of electrical signals through solder joints (Ali et al , 2021). Soldering is a common technique used in soldering processes to join electronic components and create electrical connections (Espera et al , 2019).…”