Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Li, Shizhen; Jiang, Jing; Liu, Xu; Wang, Shaogang; Zhang, Zhonghua; Ye, Huaiyu

doi:10.1109/icept59018.2023.10492230

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492230

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Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Shizhen Li,

Jing Jiang,

Xu Liu

et al.

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Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

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