The crystallization kinetics of Cu∕a-Si bilayer recording film under thermal and pulsed laser annealing has been studied. Under thermal annealing, the crystallization temperature and activation energy for crystallization of a-Si with a thin Cu metal layer were reduced to about 485°C and 3.3±0.1eV, respectively. The reaction exponent was determined to be around 1.8, corresponding to a crystallization process in which grain growth occurs with nucleation, and the nucleation rate decreases with the progress of the grain growth process. Under pulsed laser annealing, the activation energy for crystallization of a-Si was estimated to be about 0.22eV which is significantly lower than that under thermal annealing and may be explained by the explosive crystallization of a-Si, while the reaction exponent was found to vary from 1.2 to 1.4, corresponding to a grain-growth-controlled process associated with instantaneous nucleation.