Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields

Maroudas, Dimitrios; Enmark, M.; Leibig, Cora; Pantelides, Sokrates T.

doi:10.1007/bf01198662

Cited by 15 publications

(2 citation statements)

References 41 publications

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“…The model domain, ÀI`x`I, 0 y W, consists of a strip representing an Al thin ®lm in a solid state device which has been damaged by the formation of a void. The dynamics of a void under the action of external forces, such as applied electric ®elds, mechanical loads, and thermal stresses (Maroudas, Enmark, Leibig and Pantelides 1995), is of utmost importance in the context of interconnect failure. Here, the interaction of the void with an imposed electric ®eld is considered.…”

Section: Electric Fields On Voids In Interconnects Under Electromigramentioning

confidence: 99%

Galerkin boundary integral method for evaluating surface derivatives

Gray

Maroudas

Enmark

1998

Computational Mechanics

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A Galerkin boundary integral procedure for evaluating the complete derivative, e.g., potential gradient or stress tensor, is presented. The expressions for these boundary derivatives involve hypersingular kernels, and the advantage of the Galerkin approach is that the integrals exist when a continuous surface interpolation is employed. As a consequence, nodal derivative values, at smooth surface points or at corners, can be obtained directly. This method is applied to the problem of electromigrationdriven void dynamics in thin ®lm aluminum interconnects. In this application, the tangential component of the electric ®eld on the boundary is required to compute thē ux of atoms at the void surface.

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Section: Electric Fields On Voids In Interconnects Under Electromigramentioning

confidence: 99%

Galerkin boundary integral method for evaluating surface derivatives

Gray

Maroudas

Enmark

1998

Computational Mechanics

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“…An objective modelling of the void with evolving boundaries is a notoriously difficult task, because of the need to track and remesh the reference configuration. The approach used is to model the void surface as sharp discontinuities, whose position must be computed by integrating the appropriate diffusion equations with respect to time [30,37,38]. Bulk fields such as stress, electric current density and temperature may be calculated using the finite element method [4,24,27,29,31] or the boundary element method [19][20][21]32].…”

Section: Model and Governing Equationsmentioning

confidence: 99%

Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress

Wang

Sun

2006

Modelling Simul. Mater. Sci. Eng.

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The effects of the electromigration-induced stress gradient and temperature gradient on the void evolution in interconnect are examined by numerical simulation. It is found that the void in a stress gradient field will move to higher stress zone, regardless of tensile stress or compressive stress. The void motion driven by electromigration will be retarded by compressive stress gradient and accelerated by tensile stress gradient. The stress gradient has the effect of elongating the void along the interconnect line, shorting its size in line width. Hence, it may delay the open failure of the interconnect line. The temperature gradients due to current crowding cause local changes in resistivity and diffusivity in the vicinity of the evolving void, leading to void motion more rapidly along the interconnect line and void growth in the line width. Thus, the temperature gradient around the void tends to accelerate the open failure process of the interconnect.

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Surface morphological response of crystalline solids to mechanical stresses and electric fields

Maroudas

2011

Surface Science Reports

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Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields

Cited by 15 publications

References 41 publications

Galerkin boundary integral method for evaluating surface derivatives

Galerkin boundary integral method for evaluating surface derivatives

Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress

Surface morphological response of crystalline solids to mechanical stresses and electric fields

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