Analysis of current-driven motion of morphologically stable voids in metallic thin films: Steady and time-periodic states

Abstract

Articles you may be interested inElectromigration-driven complex dynamics of void surfaces in stressed metallic thin films under a general biaxial mechanical loading J. Appl. Phys. 112, 083523 (2012); 10.1063/1.4759451 Effect of applied stress tensor anisotropy on the electromechanically driven complex dynamics of void surfaces in metallic thin films J. Appl. Phys. 110, 063705 (2011); 10.1063/1.3638070 Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermalstress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications J. Appl. Phys.

Anisotropy of electromigration-induced void and island drift

“…A v with the fitting parameter C = 151 nm 2 s −1 . The slight deviations from the exact 1/R fit can be explained by the real shape being different from the theoretically assumed cylindrical one [29,30].…”

Scale effect on migration and coalescence of void in piezoelectric film subjected to gradient stress and electric fields

“…In processing of piezoelectric solids, various structural defects such as inclusions and voids in the piezoelectric solid are often generated, which have detrimental influences on the electromechanical coupling function of piezoelectric solid (Gosling and Willis, 1995; Ru, 2000). The migration motion of defects (voids) in solids has been described by means of different methods, where driven mechanisms for the migration movement of voids are surface diffusion and volume diffusion induced by thermal gradient, stress gradient, and electric potential gradient exerted on the solid (Cho et al., 2010; Desai et al., 2010; Pete et al., 2012). An electroelastic analytical method for an orthotropic piezoelectric solid with defects is presented in Sosa and Khutoryansky (1996) and Hou and Yang (1998) in which a general solution is given to describe stress concentrations that arise in the vicinity of circular and elliptical holes, and may be used as the reference to analyse the stress gradient field in orthotropic piezoelectric solid.…”