Analysis of copper plating layer discoloration caused by petal-shaped clusters morphology

Zheng, Yufeng; Bao, Shengxiang; Rao, Zhenzhen; Zhang, Chengshi; Yan, Yong

doi:10.1109/icept.2015.7236806

2015 16th International Conference on Electronic Packaging Technology (ICEPT) 2015

DOI: 10.1109/icept.2015.7236806

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Analysis of copper plating layer discoloration caused by petal-shaped clusters morphology

Yufeng Zheng

Shengxiang Bao

Zhenzhen Rao

et al.

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Analysis of copper plating layer discoloration caused by petal-shaped clusters morphology

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References 8 publications

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