Abstract:Ball grid array (BGA) has the characters of excellent heat dissipation and high mechanical strength to satisfy with the need of high density packaging of electro produces. However BGA faces some problems of complex viscoplastic deformation, difficult failure test and high repair cost. This paper establishes a complex multichip packaging module with lead-free solder ball SAC305 BGA solder ball based on nonlinear Anand viscoplasticity principle. The simulation results are obtained based on the IPC9701 standard t… Show more
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