Analysis of Abrasive Particle Trajectories during Single-Sided Lapping Process with Driven Conditioning Ring

Abstract

In this paper new kinematics systems were studied for a single lapping process. In order to ensure the constant profile wear of the tool a standard kinematic system can be changed. Lapping is carried out by applying loose abrasive grains between two surfaces and causes a relative motion between them. The result is a finish of multi-directional lay. During process, the mechanism of surface formation are decisively affected by a pressure force, a process time and a motion type of grains. It has been proven, that providing the additional movements of the conditioning ring affects the profile wear of the lapping plate. First of all, the kinematics equations of the lapping process have been developed and the process has been simulated. A type of the abrasive particle trajectories in standard single-disk lapping depends on rotational speed ratio of a tool and a conditioning ring. In addition, two new kinematic systems were presented: with radial and secant movement of the conditioning ring. Finally, comparison and analysis of abrasive trajectories were carried out.