Analysis and Verification of Integrated Circuit Thermal Parameters

Abstract

The paper describes thermal model of an ASIC designed and fabricated in CMOS 0.7 m (5 V) technology. The integrated circuit consists of analogue and digital heat sources and some temperature sensors. It has been designed to carry out some thermal tests. During tests thermal resistances, capacities, time constants and convection coefficients for different packages, positions and cooling methods were extracted. The parameters of thermal model were used in simulation to compare results with real-world measurements.