Analysis and Modeling of Thermo mechanical Deformations and Stresses in Redistribution Layers in the Fan-out Wafer Level Packaging

Evstafyev, Sergey; Vertyanov, Denis; Kochergin, Mikhail; Zhumagali, Raiymbek; Solovyov, Ilya

doi:10.1109/iceccme57830.2023.10252831

2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) 2023

DOI: 10.1109/iceccme57830.2023.10252831

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Analysis and Modeling of Thermo mechanical Deformations and Stresses in Redistribution Layers in the Fan-out Wafer Level Packaging

Sergey Evstafyev,

Denis Vertyanov,

Mikhail Kochergin

et al.

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Analysis and Modeling of Thermo mechanical Deformations and Stresses in Redistribution Layers in the Fan-out Wafer Level Packaging

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References 17 publications

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