2009
DOI: 10.1109/jproc.2009.2024663
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Analog Circuit Design in Nanoscale CMOS Technologies

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Cited by 174 publications
(95 citation statements)
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“…The conclusions can be made based on how the technology downscaling affects the different process and device parameters. Table 9.1 shows the scaling factor corresponding to the relevant device parameters [97]. The technology downscaling allows a higher oxide capacitance per unit area, a lower gate width and lower overlap and parasitic capacitances.…”
Section: / F and Thermal Noisementioning
confidence: 99%
See 1 more Smart Citation
“…The conclusions can be made based on how the technology downscaling affects the different process and device parameters. Table 9.1 shows the scaling factor corresponding to the relevant device parameters [97]. The technology downscaling allows a higher oxide capacitance per unit area, a lower gate width and lower overlap and parasitic capacitances.…”
Section: / F and Thermal Noisementioning
confidence: 99%
“…It is important to investigate the evolution of this noise when using more advanced technologies. Indeed, the gate leakage current increases by several orders of magnitude when downscaling from 180 nm to 65 nm technologies [97]. Based on (4.45), the shot noise associated to the gate leakage current is hence expected to increase significantly.…”
Section: Leakage Current Shot Noisementioning
confidence: 99%
“…Moreover, the W/L trimming for the given circuit composed of MOS transistors would in− volve extensive integration into the HSPICE simulation engine which in consequence may limit the usability of the migration software only for the particular technology and associated version of the simulator. This becomes an impor− tant issue as we consider the number of nonlinearities intro− duced by novel nanoscale CMOS fabrication processes [17]. Besides the built−in HSPICE optimization routines are generally worse suited for parameter matching in compari− son to direct search methods [18].…”
Section: Automation Of Cmos Technology Migration Illustrated By Rgb Tomentioning
confidence: 99%
“…If we were to use standard oxide transistors the V DS of M 3 , M 4 and M 2 would be too large. At high V DS the transistors can be damaged by hot-carrier injection [13]. Using thick oxide transistors removed this challenge, but for the switch transistor we've used a low-threshold thin oxide device to reduce the switch resistance.…”
Section: Bootstrapped Switchesmentioning
confidence: 99%