An XRPD Investigation of a Face-Centered Cubic Metallic Plating

Abstract

Internal elastic strain (i.e., residual stress) and the diffracted X-ray intensity variation over several orientations of crystallites with respect to the specimen surface were investigated as a means of differentiating two qualities of polycrystalline nickel plating. A unique instrument based upon a position-sensitive scintillation X-ray detector was used to apply all of the techniques commonly applied to X-ray stress analysis in this investigation. It was concluded that residual stress measurements did not provide a clear distinction between the two specimens, but comparison of the relative intensities diffracted from crystallographic planes at certain orientations with the surface did provide a distinction.

Stress measurements in nanocrystalline Ni electrodeposits

“…It is clear that all these nickel deposits have Table 3 Calculated internal stresses for nanocrystalline and microcrystalline nickel electrodeposits with and without various substrates as measured by XRD using Cu K-diffraction from (3 1 1) compressive stresses. The presence of compressive internal stresses has been previously reported in microcrystalline (polycrystalline) nickel electrodeposits [4] as well as in nanoprocessed deposits which is in agreement with published literature for nickel deposits prepared from Watts' baths containing sulfur-containing organic compounds [29,30] such as saccharin. However, compressive stresses in microcrystalline nickel deposit (Ni-4) prepared from additive-free Watts' bath is in contradiction with published literature for nickel deposits produced from similar baths using conventional DC plating.…”

“…Residual stress has been measured in polycrystalline nickel [4], nanocrystalline nickel [5], nanocrystalline metals [6,7], nanocrystalline metal alloys [8,9] and nanocomposites [10] using various methods. For electrodeposited polycrystalline nickel the residual stress has been measured to be −130 MPa (compression) by X-ray diffraction (sin 2 Ψ method) [4].…”

“…For electrodeposited polycrystalline nickel the residual stress has been measured to be −130 MPa (compression) by X-ray diffraction (sin 2 Ψ method) [4]. Nanocrystalline nickel (9-25 nm) produced by DC magnetron sputtering under varied conditions (up to −100 V bias) was measured at 500-1000 MPa residual stress (tension) determined by a method involving the curvature change due to deposition in a Si-wafer cantilever beam [5].…”

Effect of 2-butyne-1,4-diol on the microstructure and internal stress of electrodeposited Fe–36wt.%Ni alloy films

“…Fig. 4 shows the residual stress measurement results through the X-ray diffraction (sin 2 « method) [14]. When BD concentration was under 0.2 g/L, the compressive stress in the deposits decreased under a synergistic effect of addition of BD and increasing current density, the latter was reported to usually cause larger tensile stress in metal electrodeposition [7,15], and that explained why the slope decreased with addition of BD.…”