An uncooled optically readable infrared focal plane array

Feng, Fan; Zhang, Y.S.; Ge, Xiaohong; Wei, Xudong; Wang, Yan Ling; Li, X.X.

doi:10.1109/transducers.2015.7181367

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“…Therefore, high‐density Cu‐Sn bumps with small diameters are required. Cu‐Sn bonding, a simple bonding method in 3D integration, however, has a limit in achieving high‐density bumps because during bonding the melted Sn extrudes laterally and may cause electrical short of adjacent bumps [13,14].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of High‐Density Micro‐Bump Arrays for 3D Integration of MEMS and CMOS

Shi,

Wang,

Huang

et al. 2024

IEEJ Transactions Elec Engng

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Cu‐Sn transient‐liquid‐phase bonding has a limit in achieving small diameter/high‐density bumps due to the extrusion of the melted Sn layer during bonding. This paper report a new method that can fabricate small diameter Cu‐Sn bumps with 5 μm diameter and 25 μm pitch based on a new thermal reflow and pre‐bonding method that enables solid‐state Cu‐Sn reaction for avoiding Sn extrusion. Using the new method, 3D integration of a 640 × 480 MEMS array on a CMOS circuit chip has been demonstrated. This method can be used in 3D integration of MEMS arrays and CMOS circuits such as micromirror arrays. © 2024 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

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Section: Introductionmentioning

confidence: 99%