An Overview of Current Research on Simultaneous Double Side Grinding of Silicon Wafers

Abstract

Simultaneous double side grinding (SDSG) is one of the state-of-art processes to flatten silicon wafers. This paper presents an overview of current research on SDSG of silicon wafers, which includes process applications, process modeling, and possible topics for future research.

Dynamics characteristics of a rotary table motorized spindle with externally pressurized air bearings

“…(3) is mounted on the test stand (4). The spring-loaded method [14] consists of the upper load-applying block (6), the lower load-applying block (9), the load-applying bolt (1), the guide bar (2), and the spring (7). The test force is measured by the force sensor (8), and the axial displacement Δ of spindle top due to the air film deformation is measured by the micrometer (5).…”

“…1 shows the schematic view of the face grinding process, the workpiece is held by the porous ceramic vacuum chuck and driven by the rotary table spindle; the diamond cup grinding wheel is driven by the inverted motorized spindle. During grinding process, the grinding wheel and the workpiece rotate around their rotational axes simultaneously [1][2][3]. Compared with the wheel motorized spindle, the rotary table spindle has a strict technical requirement including a larger axial load capacity and a more complex configuration.…”