2016
DOI: 10.1002/tee.22338
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An overheating‐tolerant space vector modulation algorithm for multilevel inverters

Abstract: As promising and suitable candidates for high-power applications, multilevel inverters have become one of the most promising solutions in various applications. However, power switching devices are highly subjected to thermal overheating, which leads to shortened lifetime and reduced reliability. Thermal overheating may result from the degradation of power switching devices due to continuous overloading and power cycling. In addition, degradation and faults in the cooling system of power switching devices may c… Show more

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Cited by 15 publications
(1 citation statement)
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“…This voltage drop might occur as there is unbalance in the DC link capacitors voltage of the NPC inverter due to overheating of one or more of the IGBT. This event is matched with the fault signature which was investigated in 32 and classified as Temperature Signature Analysis (TSA).
Figure 10 DC link voltage vs IGBT junction temperature.
…”
Section: Methodsmentioning
confidence: 99%
“…This voltage drop might occur as there is unbalance in the DC link capacitors voltage of the NPC inverter due to overheating of one or more of the IGBT. This event is matched with the fault signature which was investigated in 32 and classified as Temperature Signature Analysis (TSA).
Figure 10 DC link voltage vs IGBT junction temperature.
…”
Section: Methodsmentioning
confidence: 99%