2022
DOI: 10.1109/led.2022.3176051
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An On-Chip Ultra-Wideband Bandpass Filter in 0.18-μm SiGe BiCMOS Technology

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Cited by 5 publications
(2 citation statements)
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“…For instance, through the analysis of the LC equivalent circuit, an on‐chip BPF based on the shunt dual‐layer meander‐line resonators and multiple metal‐insulator‐metal (MIM) capacitors is designed in [8]. Moreover, in [12], an on‐chip ultra‐wideband (UWB) BPF in 0.18‐µm SiGe BiCMOS process is presented by using cascaded highpass filter (HPF) and lowpass filter (LPF), which provides sharp passband selectivity and deep out‐of‐band rejection.…”
Section: Introductionmentioning
confidence: 99%
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“…For instance, through the analysis of the LC equivalent circuit, an on‐chip BPF based on the shunt dual‐layer meander‐line resonators and multiple metal‐insulator‐metal (MIM) capacitors is designed in [8]. Moreover, in [12], an on‐chip ultra‐wideband (UWB) BPF in 0.18‐µm SiGe BiCMOS process is presented by using cascaded highpass filter (HPF) and lowpass filter (LPF), which provides sharp passband selectivity and deep out‐of‐band rejection.…”
Section: Introductionmentioning
confidence: 99%
“…Introduction: In the design of integrated circuits (ICs) for front-end systems, passive devices such as bandpass filters (BPFs) [1][2][3][4][5][6][7][8][9][10][11][12], power dividers [13][14][15] and couplers [16][17][18] usually occupy relatively large layout space. In order to reduce the yield cost of ICs, miniaturized design of passive devices is attracting increasing attention.…”
mentioning
confidence: 99%